Notice

  • A reservation form of Miyako Hotel Kyoto Hachijo for VIP guests is available at the accommodation page.

  • The ICSJ2020 steering committee decided to extend the abstract submission deadline from May 22 to June 30, 2020. The COVID-19 outbreak has not been settled down worldwide yet. In Japan, the declaration of a state of emergency has been extended to the end of this May. We would have to understand that the current situation is still very hard for most of research organizations to submit an abstract by the original deadline. As discussed, we extended the deadline as long as we can align the conference schedule. Some international conferences have adopted remote or hybrid meetings to keep holding the conferences. ICSJ2020 does not intend to adopt any remote meeting because it cannot keep the quality of conference. In principle, ICSJ2020 will be held on-site only. In particular, author interview sessions are a big feature of ICSJ where all session speakers move to the author interview room for interactive discussions right after closing their oral session. Any remote meeting does not keep such productive discussions. Hence, the ICSJ2020 steering committee will make the final decision if we hold the conference as scheduled or not depending upon the number of submitted abstracts and the social environment of the time. The final decision will be announced on the official website promptly. To keep the quality of ICSJ2020, we sincerely hope receiving a sufficient number of contributed abstracts. We would greatly appreciate your kind understanding and continuous support.

Call for papers

You can download an electronic brochure of ICSJ2020 call for papers (PDF file).

November 9-11, 2020,

Kyoto Univ. Clock Tower Centennial Hall, KYOTO, JAPAN

http://www.ieee-csj.org/

"Electronics Packaging for 5G and B5G"

 

"IEEE CPMT Symposium Japan (ICSJ)" is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. The conference originally started in 1992 as "The VLSI Packaging Workshop in Japan (VPWJ)" and was renamed to "ICSJ" in 2010. ICSJ provides a platform for you to communicate and interact with global leaders in packaging technology. ICSJ2020 is the commemorative event for 10th ICSJ and 19th conference since establishing VPWJ.

Electronics Packaging for 5G and B5G: The 5G commercial services have just began and provide higher transmission rate, lower latency, greater capacity of remote execution, and larger number of connected devices. The 5G advantages will dramatically advance the performance of IoT services, edge computing, virtual reality (VR), autonomous mobility, as well as artificial intelligence (AI). The future mobile network after 5G, which is called as "beyond 5G (B5G)", already started technical discussions. The 5G and B5G services will realize Internet of Everything (IoE) services eventually. In 2020, our focus is on key electronics packaging technologies for next-generation mobile networks and their applications for 5G and B5G services, and emphasizes on the following main topics: Photonics, Advanced Packaging, Process & Material, Power & Automotive Electronics, Bioelectronics, and Sensing Technologies. Additional topics of primary interest to the participants are listed below.

Other topics include (but not limited to):

+ 3D Packaging & Chip-on-Chip

+ Advanced Fine Pitch Packaging, Micro Bumping, CSP

+ Board-Level Integration & Integrated Substrate

+ Laminated Materials & Processing, Materials for Packaging

+ Reliability & Failure Mechanisms

+ Packaging for High-Speed Electrical Interconnect

+ Signal Integrity / Power Integrity

+ RF Components & Modules

+ Additive Manufacturing, 3D Printed Electronics

+ Brain-like Neuromorphic Chip Assembly

+ Resilient Packaging for Autonomous System

+ Low Power / Low Temperature / Ultra Low Noise System Packaging

This conference is a perfect opportunity for you to communicate, interact, exchange technical ideas, and discuss your latest novel research findings in 5G and B5G packaging technologies with experts from industry and academia. In addition to the regular sessions, there is an "Early Career Researchers' (ECR)" poster session for young researchers with less than 2-year experience in their professions and all students including Ph.D. to hold fruitful communications with experts.

For information on Abstract Submission, click here.


Plenary/Special/Invited Speakers:

Plenary Speakers
Ming Wu (University of California, Berkeley)
Martin Schell (Fraunhofer Heinrich Hertz Institute)
John H. Lau (Unimicron Technology Corporation)
Special Speakers
Chris Bailey (University of Greenwich)
Sam Karikalan (Broadcom Inc.)
Robert Gee (Continental)
Invited Speakers
Nikolaos Bamiedakis (University of Cambridge)
Ignazio Piacentini (ficonTEC Service GmbH)
Sven Otte (Sicoya GmbH)
Agnes Tixier-Mita (The University of Tokyo)
Ki-Hun Jeong (KAIST)
Masahiro Horibe (AIST)
Katsuya Kikuchi (AIST)
Toru Ujihara (Nagoya University)


Program Chair:

Mr. Taiji Sakai

Fujitsu Interconnect Technologies Ltd.

36, Ooazakitaowaribe, Nagano 381-8501, Japan

Prof. Beomjoon Kim

The University of Tokyo

4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan

Dr. Eiji Higurashi

National Institute of Advanced Industrial Science and Technology (AIST)

1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan


Sponsor

IEEE ELECTRONICS PACKAGING SOCIETY (Formerly IEEE CPMT SOCIETY)


Location

Kyoto University Clock Tower Centennial Hall
Yoshidahonmachi, Sakyo-ku, Kyoto, 606-8501, Japan

 

Official Sponsors

In cooperation with:

Platinum Sponsor