Advanced Program

Last update: September 20, 2024

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November 13, 2024 (Wednesday)
4F/5F Main Hall I 1F Room I 1F Room II
9:00 Registration
10:10 Opening Remark (General Chair, Eiji Higurashi) 
10:25 Guest speech TBD (President of Ritsumeikan University, Yoshio Nakatani)
10:35 Award Ceremony
10:50-12:30 Plenary Speech I & II
Hall I
Chairperson TBD
10:50 Plenary Speech I: Silicon Photonic MEMS Switch for AI Super Computers
Ming Wu (University of California, Berkley)
P-02
11:40 Plenary Speech II: Silicon Photonics Light Engines with 2.5/3D Heterogeneous Integration
Radhakrishnan Nagarajan (Marvell Technology)
P-03
12:35-12:50 Platinum Sponsors' Seminar 1 (with a light meal) @Meetiing Room 1
12:50-13:05 Platinum Sponsors' Seminar 2 (with a light meal) @Meetiing Room 1
12:05-13:20 Platinum Sponsors' Seminar 3 (with a light meal) @Meetiing Room 1
13:30-15:25 Session 1: Photonics I
(Active Optical Device)
Session 2: Process and Material Technologies I Session 3: High-Speed Package and System
Chairperson Chairperson Chairperson
Nobuo Ohata (Mitsubishi Electric Corpolation) Satomi Kawamoto (NAMICS Corporation) Kazuyuki Nakagawa (Renesas Electronics Corporation)
Motohito Takezaki (Hakusan Inc.) Kei Murayama (Shinko Electric Industries Co., Ltd.) Ryo Sakamaki (AIST)
13:30 3.2T Co-Package Optics (CPO) Module Based on 200G/ch Silicon-Organic-Hybrid (SOH) 01-01 Fluxless Low-Temperature Flip Chip Solder Interconnect for Cost Reduction 02-01 (Invited) TBD 03-01
Chin-Ta Chen, Kao-Feng Tsai Teck Kheng Lee Teck Kheng Lee, Kelvin Zheng Kelvin Zheng, Kyu Sik Shim Kyu Sik Shim
Centera Photonics Inc. Institute of Technical Education
13:55 An Ultra-Compact 106-Gb/s PAM4 x 8-Channel Linear-Drive VCSEL-Based Transceiver for Co-Packaged Optics 01-02 Al wiring and Cu wiring connection by newly established AL ribbon stack bonding technology for Power package and module 02-02 High Density, High Bandwidth Copper Interconnects to Support High Density IC Packaging 03-02
Wataru Yoshida, Kazuya Nagashima, Kensho Nishizaki, Hideyuki Nasu Noriko Numata, Takashi Aoki, Koichi Hasegawa, Manabu Nejiki, Ken Yamamura, Kazuyuki Nakagawa Kevin Burt, Steve Krooswyk, Andy Shrout, Jignesh Shah, Akinori Mizumura, Chad Faith
Furukawa Electric Co., Ltd. Renesas Electronics Corporation Samtec, Inc
14:20 Over 25-GHz Bandwidth Testing Station using a 0.3-mm-Pitch LGA Interface for a 50-Gbaud x 16-channel CPO Transceiver 01-03 Enhancing Adhesion and Peel strength for fine line design on FCCSP Package 02-03 A Study on Reducing Crosstalk by Efficiently Placing Gurad Vias 03-03
Kensho Nishizaki, Kazuya Nagashima, Wataru Yoshida, Hideyuki Nasu Rick Yeh, MJ HE, Yu-Cheng Pai, Carl Chen, Yu-Po Wang Msasahiro Yao, Norio Chujo
Furukawa Electric Co., Ltd. SPIL Hitachi, Ltd.
14:45 Design of Thin-film Narrowband Retroreflector for Oblique Incidence of Diverging Wave 01-04 Comparative studies on the reliability and intermetallic integrity of novel Au-coated Ag versus Cu and Au bonding wires 02-04 Signal Integrity Analysis and Design for HBM3 on Silicon-Based 2.5D Packaging 03-04
Keisuke Sakatani, Yuya Yamanishi, Keisuke Ozawa, Junichi Inoue, Shogo Ura Randolph Flauta, Jorex Lumanog, Suqin Huang, Joe Zhou, King Man Tai, Moon Chen Li-Chieh Hung, Cheng-Yu Tsai, Hung-Chun Kuo, Ming-Fong Jhong, Chen-Chao Wang
Kyoto Institute of Technology Nexperia Group ASE
15:10 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
15:25 Coffee break + Sponsor's Exhibition
15:40-17:35 Session 4: Photonics II
(Optical Fiber and Connector)
Session 5: Process and Material Technologies II Session 6: mmWave AiP EMC Package and Systems
Chairperson Chairperson Chairperson
Hidetoshi Numata (IBM Research - Tokyo)  Satomi Kawamoto (NAMICS Corporation) Yoichiro Kurita (Tokyo Institute of Technology)
Junichi Inoue (Kyoto Institute of Technology) Naoko Araki (DAICEL CORPORATION) Wataru Shiroi (Renesas Electronics Corporation)
15:40 Bend-optimized Optical Fiber with Low Multi-path Interference in the O-band 04-01 (Invited) Thermally Stable Dry-Film Solder Resist for High Temperature Applications 05-01 Heat Dissipation Study of Sub-THz Band AiP Module 06-01
Scott Bickham, Riley Freeland, Garth Scannell, Stephen Smith, Snigdharaj Mishra, Martin Hempstead, Madison Shipman Daisuke Shibata Makoto Tsukahara1), Kei Murayama1), Hiroko Ota1), Hiroshi Taneda1), Yoichi Nakagawa2)
Corning Research and Development Corporation Taiyo Ink Mfg. Co. Ltd. 1) Shinko Electric Industries Co., Ltd.
2) Panasonic Industry Co., Ltd.
16:05 Evaluation of MPI suppression by bending a short PMF cable attached to an ELS module 04-02 Five sided protection of the chip with Bump support film impact resistance 05-02 Evaluation of Transmission Line Properties on Si-CMOS chip by Probe Backside Reflection Method in Millimeter-Wave Frequencies 06-02
Noe Ishizuka, Daiki Takeda, Tsunetoshi Saito, Hideyuki Nasu Reina Kainuma, Rikiya Kobashi, Keisuke Shinomiya, Takuo Nishida Ryo Sakamaki1), Seitaro Kon1), Ichiro Somada2), Takeshi Yoshida3), Shuhei Amakawa3), Minoru Fujishima3)
Furukawa Electric Co., Ltd LINTEC Corporation 1) AIST
2) Mitsubishi Electric Corporation
3) Hiroshima University
16:30 Quantum co-packaged optical assembly 04-03 Study on the Novel Fabrication Procedure of Polyimide Multilayer Circuits for a Space Transformer of DRAM Probe Card using Parallel Build-up Process 05-03 Socket Design for 1x4 mmWave AiP with Beamforming Testing 06-03
Bernard Lee1), Yang Chen1), R.Ryan Vallance1), Michael O'Farrel1), Abu Bakar Bhatti1), Richard Pitwon2) Seong-Dae Park, Hyunseung Yang, Hyeok Jang Chia-Ching Chu, Hong-Sheng Huang, Wen-Chun Hsiao, Sheng-Chi Hsieh, Chen-Chao Wang
1) Senko Advanced Components
2) Resolute Photonics
Korea Electronics Technology Institute ASE, Inc.
16:55 Development of Re-assemblable Multifiber Connector for Co-Packaged Optics 04-04 A Novel of Ultra Thinner Thermoelectric Device for Wireless Sensor Application 05-04 High Reliability Solutions of EMI Shielding Technology for Advanced SiP Module 06-04
Alexander William Setiawan Putra, Kentaro Matsuda, Motohito Takezaki Takuro Yoneda1), Kosuke Watanabe2), Koji Miyazaki2), Kunihisa Kato1) Mike Tsai, Ryan Chiu, James Lin, Ming-fan Tsai, Eddie Zheng, Dave Chen, Tim Chang, Nicholas Kao, J.Y. Chen, Yu-Po Wang
Hakusan Inc. 1) Lintec Corporation
2) Kyushu University
SPIL
17:20 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
17:35-18:15 Special Speech I
Hall I
Chairperson Takaaki Ishigure (Keio University) and Hideyuki Nawata (Nissan Chemical Corporation)
17:35 Wafer-scale packaging of photonic switches and transceivers
Geert Van Steenberge (imec and Ghent University)
S-05
19:15 Welcome Reception
21:15 Close
November 14, 2024 (Thursday)
4F/5F Main Hall I 1F Room I 1F Room II
9:00 Registration
9:20-11:00 Plenary Speech III
Hall I
Chairperson Shoji Uegaki (Crane Research) and Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.)
9:20 Plenary Speech III : Advance Heterogeneous Integration package solution for Silicon Photonics application
Scott Chen (Advanced Semiconductor Engineering, Inc.)
P-01
9:20-11:00 Plenary Speech IV
Hall I
TBD
10:10 Plenary Speech IV : TBD
John Knickerbocker (IBM)
P-04
11:00 Coffee break + Sponsor's Exhibition
11:10-12:40 Session 7: Advanced PKG I Session 8: Process and Material Technologies III Session 9: Bio electronics I
Chairperson Chairperson Chairperson
Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) Shinya Takyu (LINTEC Corporation) Beomjoon Kim (University of Tokyo)
Chinami Marushima (IBM Japan, Ltd.) Naoko Araki (DAICEL CORPORATION) Takafumi Fukushima (Tohoku University)
11:10 (Invited) TBD 07-01 (Invited) Polymer Optical Waveguide for Silicone Photonics 08-01 (Invited) Wearable Electronic Packaging Technology for VR and Biomedical Applications 09-01
Hiroaki Kasai Nobuyuki Otozawa Seiichi Takamatsu
Hitachi High-Tech Corporation AGC Inc. The University of Tokyo
11:35 Low temperature bonding process for Bi2Te3/Si heterojunctions 07-02 New PFAS-free optical adhesive with high heat resistance and low refractive index 08-02 (Invited) Wood Nanocellulose-Based Green Electronics 09-02
Kaixuan Wang Kaixuan Wang Masashi Kajiwara, Yoshito Yamada, Takashi Yamaguchi, Noriyuki Sakai Hirotaka Koga
Southeast University NAMICS Corporation Osaka University
12:00 Oxide microtubes fabrication with 10μm to 5μm pitches and assembly characterization 07-03 Verification of dicing method for Silicon Photonic wafers 08-03 Failure of PCBs Used as Edge-Card Connectors for Surgical Endoscopes 09-03
Natacha Raphoz, Olivier Mailliart, Patrick Peray, Cloe Desbordes, Frederic Berger, Alain Gueugnot Haruki Otaka, Kazuhiro Yoshida, Tomoharu Fujii Kshitij Jayantilal Bopalkar, Viraj Patwardhan, Anthony Okello, Adi Chola Venkatesh
CEA-LETI Shinko Electric Industries Co., Ltd.  Vision Engineering Intuitive
12:25 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
12:40-13:45 Lunch (free time)
13:45-15:40 Session 10: Hybrid bonding Session 11: Photonics II
 (Photonics Packaging)
Session 12: Bio electronics II
Chairperson Chairperson Chairperson
Takafumi Fukushima (Tohoku University) Hidetoshi Numata (IBM Research - Tokyo)  Shigenori Aoki (LINTEC Corporation)
Kenji Takahashi (AIST) Nobuo Ohata (Mitsubishi Electric Corpolation) Kai Takeuchi (Tohoku University)
13:45 (Invited) Hybrid Bonding in Advanced Heterogenous Integration: Key Metrology Enablers 10-01 Ultra High Optical Output Power 8-channel ELS Module Employing a Blind Mate Optical Connector for Co-Packaged Optics 11-01 Diagnosing PCB(A) deficiencies in medical instruments during reprocessing and sterilization cycles 12-01
Bongsub Lee Yuki Shiroishi, Taketsugu Sawamura, Kohei Umeta, Hideyuki Nasu Toshak Singhal, Viraj Patwardhan
Adeia Inc. Furukawa Electric Co., Ltd Intuitive Surgical Inc
14:10 (Invited) Fine pitch die-to-wafer hybrid bonding integration 10-02 High-Bandwidth Optical Transmission with Single External Laser Source (ELS) and Polymer Splitters for Co-packaged Optics 11-02 Development of optical microneedle lens array to deliver light efficiently for photodynamic therapy to treat basal cell carcinoma 12-02
Ye Lin Satoshi Suda, Md Omar Faruk Rasel, Takayuki Kurosu, Akihiro Noriki, Tadashi Murao, Takeru Amano Anthony Lefebvre1), Wataru Hanamoto1), Jongho Park1), Anne-Sophie Dewalle-Vignion2), Guillaume Paul Grolez2), Nadira Delhem2), Laurent Mortier2), Beomjoon Kim1)
imec AIST 1) The University of Tokyo
2) Univ. Lille
14:35 (Invited) Next-Generation Wafer-to-Wafer Bonding Technologies for Sub-50nm Bonding Overlay Accuracy 10-03 Co-Design of Photonic IC, Electronic IC, and Interposer for 1.6 Tbps O/E Converter in Active Optical Package 11-03 Simulation and Fabrication of Highly Bendable Advanced 3D Corrugated Interconnects Using Flexible FOWLP 12-03
Tomohiro Chiba Naoki Matsui1), Akihiro Noriki2), Haruhiko Kuwatsuka2), Fumi Nakamura2), Satoshi Suda2), Takayuki Kurosu2), Takeru Amano2), Satoshi Ishikawa1), Hiromichi Yoshikawa1), Dan Maeda1), Tomoya Sugita1), Hirotaka Uemura1) HAN ZHANG, Jiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi Fukushima
Nikon Corporation 1) KYOCERA Corporation
2) AIST
Tohoku University
15:00 (Invited) CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory 10-04 (Invited) TBD 11-04 Multichip-to-Wafer Mini-LED Bonding Technology for Photobiomodulation Sheet Devices Using Flexible FOWLP 12-04
Masayoshi Tagami Xingyao Guo, Jiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi Fukushima
Kioxia Corporation Tohoku University
15:25 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
15:40 Coffee break + Sponsor's Exhibition
15:50-16:30 IEEE EPS Special Speech I
Hall I
Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University)
15:50 IEEE EPS Special Speech I: Technologies for Chiplet based System Integration
Tanja Braun (Fraunhofer IZM)
S-01
16:30-16:50 IEEE EPS Special Speech II
Hall I
Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University)
16:30 IEEE EPS Special Speech II: Mechanical Behavior of Solder Micro Bumps in Advanced Packaging for Heterogeneous Integration
Jeffrey Suhling (Auburn University)
S-02
16:50 Coffee break + Sponsor's Exhibition
17:00-18:00 Early Career Researcher's (ECR) Session (Open Forum with Beer) @ 1F Room I
Chairperson TBD
Poster presentation
Multi-channel Integration of Polymer Spot Size Expander on Silicon Photonics Chip ECR-01 Formation of Au hollow micro-bump arrays for low temperature Au-Au bonding ECR-02 Development of Through Semiconductor Via manufacturing process for heterogeneous integration of GaN power device on Si-LSI ECR-03
Atsuki Sawada1), Yoshiki Kamiura2), Chiemi Fujikawa1), Osamu Mikami3) Shintaro Goto1), Kai Takeuchi1), Le Hac Huong Thu2), Takashi Matsumae2), Hideki Takagi2), Yuichi Kurashima2), Eiji Higurashi1) Hidejiro Mishima, Kaiyuan Zheng, Satoshi Matsumoto, Satoko Shinkai
1) Tokai University
2) Kyushu University
3) Universiti Teknologi Malaysia
1) Tohoku University
2) AIST
Kyushu Institute of Technology
Direct Connection of Multimode Polymer Waveguide and Multimode Fibers Using the Mosquito Method ECR-04 Structural investigation of microchannel and optical waveguide co-integrated sensor devices ECR-05 Field size converter for edge coupling of multimode LD to thin film waveguide ECR-06
Tatsuya Nakamura, Takaaki Ishigure Tomohiro Ichizuka, Takaaki Ishigure Yuya Yamanishi1), Junichi Inoue1), Keisuke Ozawa1), Kenji Kintaka2), Kouki Ichihashi3), Ura Shogo1)
Keio University Keio University 1) Kyoto Institute of Technology
2) National Institute of Advanced Industrial Science and Technology
3) Panasonic Holdings Corp.
Feasibility Study of Self Assembly Using Copper Nano Film Formed by Blue Laser for Die-to-Wafer Hybrid Bonding ECR-07 3D Polymer Optical Waveguide-based Fan-in/out Device for Silicon Photonics ECR-08 Fixed connection of single-mode polymer optical waveguide with single-mode optical fiber ECR-09
Hayami Asahara, Kiyokazu Yasuda Anzu Ito, Takaaki Ishigure Shunsuke Toshida, Takaaki Ishigure
Osaka University Keio University Keio University
Sequential surface treatment process with VUV light and Ar plasma for room temperature Au-Au bonding ECR-10 Adhesion between Si Substrates in Liquid Water using Inorganic Polymer ECR-11
Mika Ogino, Kai Takeuchi, Eiji Higurashi Daiki Nemoto, Kai Takeuchi, Eiji Higurashi
Tohoku University Tohoku University
18:00 Close
November 15, 2024 (Friday)
4F/5F Main Hall I 1F Room I 1F Room II
9:00 Registration
9:20 ECR Award Ceremony
9:30-10:10 Special Speech II
Hall I
Chairperson TBD
9:30 Special Speech II: Innovation and steps in hetero-integration
Harald Kuhn (Fraunhofer ENAS)
S-03
10:10-10:50 Special Speech III
Hall I
Chairperson Kraisorn Throngnumchai (Kanagawa Institute of Technology) and Yutaka Uematsu (Hitachi, Ltd.)
10:10 Special Speech III: Wireless Power Transfer Theory Established Last Decade
Takashi Ohira (Toyohashi University of Technology)
S-04
10:50 Coffee break + Sponsor's Exhibition 
11:00-12:55 Session 13: IEEE EPS Technical session Session 14: Advanced Automotive Electronics Session 15: Advanced PKG II
Chairperson Chairperson Chairperson
Shigenori Aoki (LINTEC Corporation) Atsushi Nakamura (Ultimate Technologies Inc.) Kiyokazu Yasuda (Osaka University)
Takashi Hisada (Rapidus) Yutaka Uematsu (Hitachi, Ltd.) Shoji Uegaki (Crane Research)
11:00 (Invited) TBD 13-01 (Invited) Application of EMC Simulation Including Semiconductor to Reduce Development Lead Time 14-01 Novel Additive Manufacturing Platform for Freeform 3D Microelectronics and Packaging 15-01
Mohan Kathaperumal Kazuki Furukawa Darragh Walsh, Jeroen Sol, Hylke Akkerman
Georgia Institute of Technology AISIN Corporation Holst Centre/TNO
11:25 (Invited) TBD 13-02 Compact Design for Automotive High-Performance Computing Using a Two-Layer Daughter Board Structure 14-02 Effect of Microstructure on the Electromigration Performance of 2-μm-Cu Redistribution Line under In-situ SEM Observation 15-02
Yoichiro Sato Soshi Shimomura, Masako Kato, Yutaka Uematsu Min-Yan Tsai, Ting-Chun Lin, Yen-Cheng Huang, Shan-Bo Wang, Yung-Sheng Lin, Kwang-Lung Lin
AGC Inc. Hitachi, Ltd. ASE Group
11:50 (Invited) TBD 13-03 Efficient German License Plate Recognition System Integrating YOLOv8 Model and EasyOCR 14-03 Implementation of Curved CMOS Image Sensors by Transferring Silicon-On-Insulator Layers 15-03
SB Park Hasan Aljzaere, Atul Chandra Nath, Wolfram Hardt Masahide Goto, Shigeyuki Imura, Hiroto Sato
Binghamton University Chemnitz University of Technology NHK Science & Technology Research Laboratories
12:15 (Invited) TBD 13-04 High-Performance Flip-Chip BGA Packages Reliability Prediction in Automotive Applications 14-04
Bo-Heng Chen, Wei-Hong Lai, Chin-Li Kao, Alexcc Wang, CP Hung
ASE Inc.
12:40 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
12:55-14:25 Lunch (free time)
14:25-16:45 Session 16: Photonics IV
(Glass and Polymer for Photonics)
Session 17: Automotive Power Electronics Session 19: Power Electronics Materials and devices of UWBG and WBG semiconductors
Chairperson Chairperson Chairperson
Hideyuki Nasu (Furukawa Electric Co., Ltd.)  Yutaka Uematsu (Hitachi, Ltd.) Kentaro Kaneko (Ritsumeikan University)
Motohito Takezaki (Hakusan Inc.) Atsushi Nakamura (Ultimate Technologies Inc.) Hiroki Imabayashi (University of Fukui)
14:25 (Invited) TBD 16-01 (Invited) EMC overview, Causes and Physics 17-01 (Invited) Recent progress and task of GaN materials and devices for power applications 19-01
Hideho Yamamura Yohei Otoki
Ultimate Technologies Inc. SCIOCS Co. Ltd.
14:50 Towards scalable aligned two photon lithography for photonic integration 16-02 A Review of BMW iX3 Power Module – Part 1: Inner Configuration, Die Attachment, Busbar Connection and Molding 17-02 Ag Sintering based Die Attach for Power Package and Power Module Applications 19-02
Mareike Trappen, Matthias Blaicher, Tobias Hoose, Nicole Lindenmann, Stephan Dottermusch, Benjamin Richter, Andrea Bertoncini, Michael Thiel Thiyu Warnakulasooriya, Jiyoon Choi, Sihoon Choi, Jun Imaoka, Masayoshi Yamamoto Tamimoto Hideaki Tamimoto Hideaki, Kazuki Matsumura, Kazuyuki Nakagawa, Kenji Ikura, Chikara Obama
Nanoscribe GmbH & Co. KG Nagoya University Renesas Electronics Corporation
15:15 Loss reduction of Y-branched single-mode polymer optical waveguide for MUX/DEMUX devices in mode division multiplexing links. 16-03 A Review of BMW iX3 Power Module – Part 2: Novel Heatsink Structure, Stacked-plate Fin Configuration 17-03 Simulation Study of Factor Effect on Transient Thermal Ramp Up Test Performance for Electronic Power Devices 19-03
Seiya Sakai, Takaaki Ishigure Jiyoon Choi, Thiyu Warnakulasooriya, Sihoon Choi, Jun Imaoka, Masayoshi Yamamoto Nick Chenchao Zhong, Haibo Fan, Yuning Shi
Keio University Nagoya University Nexperia Group
15:40 Polarization dependent characteristics of polymer optical waveguide 16-04 Session 18: Photonics V
(Laser Technology for photonics)
Effect of Sb dopant in r-GeO2 thin films for high-temperature growth 19-04
Chairperson
Hideyki Nawata (Nissan Chemical Corporation)
Junichi Inoue (Kyoto Institute of Technology)
Takumi Wakabayashi, Takaaki Ishigure Post-fab laser trimming: increasing yield and lowering power consumption of PICs 18-01 Toya Yagura1,2), Yuri Shimizu2), Toyosuke Ibi1), Isao Takahashi1), Kentaro Kaneko1,2)
Ignazio Piacentini1), Louis-Rafael Robichaud2), Simon Duval2)
Keio University 1) IP Consulting
2) Femtum Inc.
1) Patentix Inc.
2) Ritsumeikan Univ.
16:05 Fabrication of a glass sub-mount with high heat dissipation 16-05 Heat Assisted Magnetic Recording - Ultra-dense laser and plasmonic component integration to increase storage density on magnetic media 18-02 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
Takuma Fujita, Asami Uchiyama, Shinya Okuda, Mizuki Shirao, Nobuo Ohata Mark Gubbins, Beverley McConnell, Michael Kautzy, Anil Reddy, Richard Pitwon
Mitsubishi Electric Corpolation Seagate Technology
16:30 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
16:45 Close
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