Advanced Program
Last update: September 20, 2024
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November 13, 2024 (Wednesday) | ||||||
4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
9:00 | Registration | |||||
10:10 | Opening Remark (General Chair, Eiji Higurashi) | |||||
10:25 | Guest speech TBD (President of Ritsumeikan University, Yoshio Nakatani) | |||||
10:35 | Award Ceremony | |||||
10:50-12:30 | Plenary Speech I & II | |||||
Hall I | ||||||
Chairperson TBD | ||||||
10:50 | Plenary Speech I: Silicon Photonic MEMS Switch for AI Super
Computers Ming Wu (University of California, Berkley) |
P-02 | ||||
11:40 | Plenary Speech
II: Silicon Photonics Light Engines with 2.5/3D Heterogeneous
Integration Radhakrishnan Nagarajan (Marvell Technology) |
P-03 | ||||
12:35-12:50 | Platinum Sponsors' Seminar 1 (with a light meal) @Meetiing Room 1 | |||||
12:50-13:05 | Platinum Sponsors' Seminar 2 (with a light meal) @Meetiing Room 1 | |||||
12:05-13:20 | Platinum Sponsors' Seminar 3 (with a light meal) @Meetiing Room 1 | |||||
13:30-15:25 | Session 1: Photonics I (Active Optical Device) |
Session 2: Process and Material Technologies I | Session 3: High-Speed Package and System | |||
Chairperson | Chairperson | Chairperson | ||||
Nobuo Ohata (Mitsubishi Electric Corpolation) | Satomi Kawamoto (NAMICS Corporation) | Kazuyuki Nakagawa (Renesas Electronics Corporation) | ||||
Motohito Takezaki (Hakusan Inc.) | Kei Murayama (Shinko Electric Industries Co., Ltd.) | Ryo Sakamaki (AIST) | ||||
13:30 | 3.2T Co-Package Optics (CPO) Module Based on 200G/ch Silicon-Organic-Hybrid (SOH) | 01-01 | Fluxless Low-Temperature Flip Chip Solder Interconnect for Cost Reduction | 02-01 | (Invited) TBD | 03-01 |
Chin-Ta Chen, Kao-Feng Tsai | Teck Kheng Lee Teck Kheng Lee, Kelvin Zheng Kelvin Zheng, Kyu Sik Shim Kyu Sik Shim | |||||
Centera Photonics Inc. | Institute of Technical Education | |||||
13:55 | An Ultra-Compact 106-Gb/s PAM4 x 8-Channel Linear-Drive VCSEL-Based Transceiver for Co-Packaged Optics | 01-02 | Al wiring and Cu wiring connection by newly established AL ribbon stack bonding technology for Power package and module | 02-02 | High Density, High Bandwidth Copper Interconnects to Support High Density IC Packaging | 03-02 |
Wataru Yoshida, Kazuya Nagashima, Kensho Nishizaki, Hideyuki Nasu | Noriko Numata, Takashi Aoki, Koichi Hasegawa, Manabu Nejiki, Ken Yamamura, Kazuyuki Nakagawa | Kevin Burt, Steve Krooswyk, Andy Shrout, Jignesh Shah, Akinori Mizumura, Chad Faith | ||||
Furukawa Electric Co., Ltd. | Renesas Electronics Corporation | Samtec, Inc | ||||
14:20 | Over 25-GHz Bandwidth Testing Station using a 0.3-mm-Pitch LGA Interface for a 50-Gbaud x 16-channel CPO Transceiver | 01-03 | Enhancing Adhesion and Peel strength for fine line design on FCCSP Package | 02-03 | A Study on Reducing Crosstalk by Efficiently Placing Gurad Vias | 03-03 |
Kensho Nishizaki, Kazuya Nagashima, Wataru Yoshida, Hideyuki Nasu | Rick Yeh, MJ HE, Yu-Cheng Pai, Carl Chen, Yu-Po Wang | Msasahiro Yao, Norio Chujo | ||||
Furukawa Electric Co., Ltd. | SPIL | Hitachi, Ltd. | ||||
14:45 | Design of Thin-film Narrowband Retroreflector for Oblique Incidence of Diverging Wave | 01-04 | Comparative studies on the reliability and intermetallic integrity of novel Au-coated Ag versus Cu and Au bonding wires | 02-04 | Signal Integrity Analysis and Design for HBM3 on Silicon-Based 2.5D Packaging | 03-04 |
Keisuke Sakatani, Yuya Yamanishi, Keisuke Ozawa, Junichi Inoue, Shogo Ura | Randolph Flauta, Jorex Lumanog, Suqin Huang, Joe Zhou, King Man Tai, Moon Chen | Li-Chieh Hung, Cheng-Yu Tsai, Hung-Chun Kuo, Ming-Fong Jhong, Chen-Chao Wang | ||||
Kyoto Institute of Technology | Nexperia Group | ASE | ||||
15:10 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
15:25 | Coffee break + Sponsor's Exhibition | |||||
15:40-17:35 | Session 4: Photonics II (Optical Fiber and Connector) |
Session 5: Process and Material Technologies II | Session 6: mmWave AiP EMC Package and Systems | |||
Chairperson | Chairperson | Chairperson | ||||
Hidetoshi Numata (IBM Research - Tokyo) | Satomi Kawamoto (NAMICS Corporation) | Yoichiro Kurita (Tokyo Institute of Technology) | ||||
Junichi Inoue (Kyoto Institute of Technology) | Naoko Araki (DAICEL CORPORATION) | Wataru Shiroi (Renesas Electronics Corporation) | ||||
15:40 | Bend-optimized Optical Fiber with Low Multi-path Interference in the O-band | 04-01 | (Invited) Thermally Stable Dry-Film Solder Resist for High Temperature Applications | 05-01 | Heat Dissipation Study of Sub-THz Band AiP Module | 06-01 |
Scott Bickham, Riley Freeland, Garth Scannell, Stephen Smith, Snigdharaj Mishra, Martin Hempstead, Madison Shipman | Daisuke Shibata | Makoto Tsukahara1), Kei Murayama1), Hiroko Ota1), Hiroshi Taneda1), Yoichi Nakagawa2) | ||||
Corning Research and Development Corporation | Taiyo Ink Mfg. Co. Ltd. | 1) Shinko Electric Industries Co., Ltd. 2) Panasonic Industry Co., Ltd. |
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16:05 | Evaluation of MPI suppression by bending a short PMF cable attached to an ELS module | 04-02 | Five sided protection of the chip with Bump support film impact resistance | 05-02 | Evaluation of Transmission Line Properties on Si-CMOS chip by Probe Backside Reflection Method in Millimeter-Wave Frequencies | 06-02 |
Noe Ishizuka, Daiki Takeda, Tsunetoshi Saito, Hideyuki Nasu | Reina Kainuma, Rikiya Kobashi, Keisuke Shinomiya, Takuo Nishida | Ryo Sakamaki1), Seitaro Kon1), Ichiro Somada2), Takeshi Yoshida3), Shuhei Amakawa3), Minoru Fujishima3) | ||||
Furukawa Electric Co., Ltd | LINTEC Corporation | 1) AIST 2) Mitsubishi Electric Corporation 3) Hiroshima University |
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16:30 | Quantum co-packaged optical assembly | 04-03 | Study on the Novel Fabrication Procedure of Polyimide Multilayer Circuits for a Space Transformer of DRAM Probe Card using Parallel Build-up Process | 05-03 | Socket Design for 1x4 mmWave AiP with Beamforming Testing | 06-03 |
Bernard Lee1), Yang Chen1), R.Ryan Vallance1), Michael O'Farrel1), Abu Bakar Bhatti1), Richard Pitwon2) | Seong-Dae Park, Hyunseung Yang, Hyeok Jang | Chia-Ching Chu, Hong-Sheng Huang, Wen-Chun Hsiao, Sheng-Chi Hsieh, Chen-Chao Wang | ||||
1) Senko Advanced Components 2) Resolute Photonics |
Korea Electronics Technology Institute | ASE, Inc. | ||||
16:55 | Development of Re-assemblable Multifiber Connector for Co-Packaged Optics | 04-04 | A Novel of Ultra Thinner Thermoelectric Device for Wireless Sensor Application | 05-04 | High Reliability Solutions of EMI Shielding Technology for Advanced SiP Module | 06-04 |
Alexander William Setiawan Putra, Kentaro Matsuda, Motohito Takezaki | Takuro Yoneda1), Kosuke Watanabe2), Koji Miyazaki2), Kunihisa Kato1) | Mike Tsai, Ryan Chiu, James Lin, Ming-fan Tsai, Eddie Zheng, Dave Chen, Tim Chang, Nicholas Kao, J.Y. Chen, Yu-Po Wang | ||||
Hakusan Inc. | 1) Lintec Corporation 2) Kyushu University |
SPIL | ||||
17:20 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
17:35-18:15 | Special Speech I | |||||
Hall I | ||||||
Chairperson Takaaki Ishigure (Keio University) and Hideyuki Nawata (Nissan Chemical Corporation) | ||||||
17:35 | Wafer-scale packaging of photonic switches and
transceivers Geert Van Steenberge (imec and Ghent University) |
S-05 | ||||
19:15 | Welcome Reception | |||||
21:15 | Close | |||||
November 14, 2024 (Thursday) | ||||||
4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
9:00 | Registration | |||||
9:20-11:00 | Plenary Speech III | |||||
Hall I | ||||||
Chairperson Shoji Uegaki (Crane Research) and Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) | ||||||
9:20 | Plenary
Speech III : Advance Heterogeneous Integration package solution for Silicon
Photonics application Scott Chen (Advanced Semiconductor Engineering, Inc.) |
P-01 | ||||
9:20-11:00 | Plenary Speech IV | |||||
Hall I | ||||||
TBD | ||||||
10:10 | Plenary
Speech IV : TBD John Knickerbocker (IBM) |
P-04 | ||||
11:00 | Coffee break + Sponsor's Exhibition | |||||
11:10-12:40 | Session 7: Advanced PKG I | Session 8: Process and Material Technologies III | Session 9: Bio electronics I | |||
Chairperson | Chairperson | Chairperson | ||||
Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) | Shinya Takyu (LINTEC Corporation) | Beomjoon Kim (University of Tokyo) | ||||
Chinami Marushima (IBM Japan, Ltd.) | Naoko Araki (DAICEL CORPORATION) | Takafumi Fukushima (Tohoku University) | ||||
11:10 | (Invited) TBD | 07-01 | (Invited) Polymer Optical Waveguide for Silicone Photonics | 08-01 | (Invited) Wearable Electronic Packaging Technology for VR and Biomedical Applications | 09-01 |
Hiroaki Kasai | Nobuyuki Otozawa | Seiichi Takamatsu | ||||
Hitachi High-Tech Corporation | AGC Inc. | The University of Tokyo | ||||
11:35 | Low temperature bonding process for Bi2Te3/Si heterojunctions | 07-02 | New PFAS-free optical adhesive with high heat resistance and low refractive index | 08-02 | (Invited) Wood Nanocellulose-Based Green Electronics | 09-02 |
Kaixuan Wang Kaixuan Wang | Masashi Kajiwara, Yoshito Yamada, Takashi Yamaguchi, Noriyuki Sakai | Hirotaka Koga | ||||
Southeast University | NAMICS Corporation | Osaka University | ||||
12:00 | Oxide microtubes fabrication with 10μm to 5μm pitches and assembly characterization | 07-03 | Verification of dicing method for Silicon Photonic wafers | 08-03 | Failure of PCBs Used as Edge-Card Connectors for Surgical Endoscopes | 09-03 |
Natacha Raphoz, Olivier Mailliart, Patrick Peray, Cloe Desbordes, Frederic Berger, Alain Gueugnot | Haruki Otaka, Kazuhiro Yoshida, Tomoharu Fujii | Kshitij Jayantilal Bopalkar, Viraj Patwardhan, Anthony Okello, Adi Chola Venkatesh | ||||
CEA-LETI | Shinko Electric Industries Co., Ltd. | Vision Engineering Intuitive | ||||
12:25 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
12:40-13:45 | Lunch (free time) | |||||
13:45-15:40 | Session 10: Hybrid bonding | Session 11: Photonics II (Photonics Packaging) |
Session 12: Bio electronics II | |||
Chairperson | Chairperson | Chairperson | ||||
Takafumi Fukushima (Tohoku University) | Hidetoshi Numata (IBM Research - Tokyo) | Shigenori Aoki (LINTEC Corporation) | ||||
Kenji Takahashi (AIST) | Nobuo Ohata (Mitsubishi Electric Corpolation) | Kai Takeuchi (Tohoku University) | ||||
13:45 | (Invited) Hybrid Bonding in Advanced Heterogenous Integration: Key Metrology Enablers | 10-01 | Ultra High Optical Output Power 8-channel ELS Module Employing a Blind Mate Optical Connector for Co-Packaged Optics | 11-01 | Diagnosing PCB(A) deficiencies in medical instruments during reprocessing and sterilization cycles | 12-01 |
Bongsub Lee | Yuki Shiroishi, Taketsugu Sawamura, Kohei Umeta, Hideyuki Nasu | Toshak Singhal, Viraj Patwardhan | ||||
Adeia Inc. | Furukawa Electric Co., Ltd | Intuitive Surgical Inc | ||||
14:10 | (Invited) Fine pitch die-to-wafer hybrid bonding integration | 10-02 | High-Bandwidth Optical Transmission with Single External Laser Source (ELS) and Polymer Splitters for Co-packaged Optics | 11-02 | Development of optical microneedle lens array to deliver light efficiently for photodynamic therapy to treat basal cell carcinoma | 12-02 |
Ye Lin | Satoshi Suda, Md Omar Faruk Rasel, Takayuki Kurosu, Akihiro Noriki, Tadashi Murao, Takeru Amano | Anthony Lefebvre1), Wataru Hanamoto1), Jongho Park1), Anne-Sophie Dewalle-Vignion2), Guillaume Paul Grolez2), Nadira Delhem2), Laurent Mortier2), Beomjoon Kim1) | ||||
imec | AIST | 1) The University of Tokyo 2) Univ. Lille |
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14:35 | (Invited) Next-Generation Wafer-to-Wafer Bonding Technologies for Sub-50nm Bonding Overlay Accuracy | 10-03 | Co-Design of Photonic IC, Electronic IC, and Interposer for 1.6 Tbps O/E Converter in Active Optical Package | 11-03 | Simulation and Fabrication of Highly Bendable Advanced 3D Corrugated Interconnects Using Flexible FOWLP | 12-03 |
Tomohiro Chiba | Naoki Matsui1), Akihiro Noriki2), Haruhiko Kuwatsuka2), Fumi Nakamura2), Satoshi Suda2), Takayuki Kurosu2), Takeru Amano2), Satoshi Ishikawa1), Hiromichi Yoshikawa1), Dan Maeda1), Tomoya Sugita1), Hirotaka Uemura1) | HAN ZHANG, Jiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi Fukushima | ||||
Nikon Corporation | 1) KYOCERA Corporation 2) AIST |
Tohoku University | ||||
15:00 | (Invited) CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory | 10-04 | (Invited) TBD | 11-04 | Multichip-to-Wafer Mini-LED Bonding Technology for Photobiomodulation Sheet Devices Using Flexible FOWLP | 12-04 |
Masayoshi Tagami | Xingyao Guo, Jiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi Fukushima | |||||
Kioxia Corporation | Tohoku University | |||||
15:25 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
15:40 | Coffee break + Sponsor's Exhibition | |||||
15:50-16:30 | IEEE EPS Special Speech I | |||||
Hall I | ||||||
Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University) | ||||||
15:50 | IEEE EPS Special Speech I: Technologies for
Chiplet based System Integration Tanja Braun (Fraunhofer IZM) |
S-01 | ||||
16:30-16:50 | IEEE EPS Special Speech II | |||||
Hall I | ||||||
Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University) | ||||||
16:30 | IEEE EPS Special Speech II: Mechanical Behavior
of Solder Micro Bumps in Advanced Packaging for Heterogeneous
Integration Jeffrey Suhling (Auburn University) |
S-02 | ||||
16:50 | Coffee break + Sponsor's Exhibition | |||||
17:00-18:00 | Early Career Researcher's (ECR) Session (Open Forum with Beer) @ 1F Room I | |||||
Chairperson TBD | ||||||
Poster presentation | ||||||
Multi-channel Integration of Polymer Spot Size Expander on Silicon Photonics Chip | ECR-01 | Formation of Au hollow micro-bump arrays for low temperature Au-Au bonding | ECR-02 | Development of Through Semiconductor Via manufacturing process for heterogeneous integration of GaN power device on Si-LSI | ECR-03 | |
Atsuki Sawada1), Yoshiki Kamiura2), Chiemi Fujikawa1), Osamu Mikami3) | Shintaro Goto1), Kai Takeuchi1), Le Hac Huong Thu2), Takashi Matsumae2), Hideki Takagi2), Yuichi Kurashima2), Eiji Higurashi1) | Hidejiro Mishima, Kaiyuan Zheng, Satoshi Matsumoto, Satoko Shinkai | ||||
1) Tokai University 2) Kyushu University 3) Universiti Teknologi Malaysia |
1) Tohoku
University 2) AIST |
Kyushu Institute of Technology | ||||
Direct Connection of Multimode Polymer Waveguide and Multimode Fibers Using the Mosquito Method | ECR-04 | Structural investigation of microchannel and optical waveguide co-integrated sensor devices | ECR-05 | Field size converter for edge coupling of multimode LD to thin film waveguide | ECR-06 | |
Tatsuya Nakamura, Takaaki Ishigure | Tomohiro Ichizuka, Takaaki Ishigure | Yuya Yamanishi1), Junichi Inoue1), Keisuke Ozawa1), Kenji Kintaka2), Kouki Ichihashi3), Ura Shogo1) | ||||
Keio University | Keio University | 1) Kyoto
Institute of Technology 2) National Institute of Advanced Industrial Science and Technology 3) Panasonic Holdings Corp. |
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Feasibility Study of Self Assembly Using Copper Nano Film Formed by Blue Laser for Die-to-Wafer Hybrid Bonding | ECR-07 | 3D Polymer Optical Waveguide-based Fan-in/out Device for Silicon Photonics | ECR-08 | Fixed connection of single-mode polymer optical waveguide with single-mode optical fiber | ECR-09 | |
Hayami Asahara, Kiyokazu Yasuda | Anzu Ito, Takaaki Ishigure | Shunsuke Toshida, Takaaki Ishigure | ||||
Osaka University | Keio University | Keio University | ||||
Sequential surface treatment process with VUV light and Ar plasma for room temperature Au-Au bonding | ECR-10 | Adhesion between Si Substrates in Liquid Water using Inorganic Polymer | ECR-11 | |||
Mika Ogino, Kai Takeuchi, Eiji Higurashi | Daiki Nemoto, Kai Takeuchi, Eiji Higurashi | |||||
Tohoku University | Tohoku University | |||||
18:00 | Close | |||||
November 15, 2024 (Friday) | ||||||
4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
9:00 | Registration | |||||
9:20 | ECR Award Ceremony | |||||
9:30-10:10 | Special Speech II | |||||
Hall I | ||||||
Chairperson TBD | ||||||
9:30 | Special Speech II: Innovation and steps in
hetero-integration Harald Kuhn (Fraunhofer ENAS) |
S-03 | ||||
10:10-10:50 | Special Speech III | |||||
Hall I | ||||||
Chairperson Kraisorn Throngnumchai (Kanagawa Institute of Technology) and Yutaka Uematsu (Hitachi, Ltd.) | ||||||
10:10 | Special Speech III: Wireless Power Transfer
Theory Established Last Decade Takashi Ohira (Toyohashi University of Technology) |
S-04 | ||||
10:50 | Coffee break + Sponsor's Exhibition | |||||
11:00-12:55 | Session 13: IEEE EPS Technical session | Session 14: Advanced Automotive Electronics | Session 15: Advanced PKG II | |||
Chairperson | Chairperson | Chairperson | ||||
Shigenori Aoki (LINTEC Corporation) | Atsushi Nakamura (Ultimate Technologies Inc.) | Kiyokazu Yasuda (Osaka University) |
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Takashi Hisada (Rapidus) | Yutaka Uematsu (Hitachi, Ltd.) | Shoji Uegaki (Crane Research) | ||||
11:00 | (Invited) TBD | 13-01 | (Invited) Application of EMC Simulation Including Semiconductor to Reduce Development Lead Time | 14-01 | Novel Additive Manufacturing Platform for Freeform 3D Microelectronics and Packaging | 15-01 |
Mohan Kathaperumal | Kazuki Furukawa | Darragh Walsh, Jeroen Sol, Hylke Akkerman | ||||
Georgia Institute of Technology | AISIN Corporation | Holst Centre/TNO | ||||
11:25 | (Invited) TBD | 13-02 | Compact Design for Automotive High-Performance Computing Using a Two-Layer Daughter Board Structure | 14-02 | Effect of Microstructure on the Electromigration Performance of 2-μm-Cu Redistribution Line under In-situ SEM Observation | 15-02 |
Yoichiro Sato | Soshi Shimomura, Masako Kato, Yutaka Uematsu | Min-Yan Tsai, Ting-Chun Lin, Yen-Cheng Huang, Shan-Bo Wang, Yung-Sheng Lin, Kwang-Lung Lin | ||||
AGC Inc. | Hitachi, Ltd. | ASE Group | ||||
11:50 | (Invited) TBD | 13-03 | Efficient German License Plate Recognition System Integrating YOLOv8 Model and EasyOCR | 14-03 | Implementation of Curved CMOS Image Sensors by Transferring Silicon-On-Insulator Layers | 15-03 |
SB Park | Hasan Aljzaere, Atul Chandra Nath, Wolfram Hardt | Masahide Goto, Shigeyuki Imura, Hiroto Sato | ||||
Binghamton University | Chemnitz University of Technology | NHK Science & Technology Research Laboratories | ||||
12:15 | (Invited) TBD | 13-04 | High-Performance Flip-Chip BGA Packages Reliability Prediction in Automotive Applications | 14-04 | ||
Bo-Heng Chen, Wei-Hong Lai, Chin-Li Kao, Alexcc Wang, CP Hung | ||||||
ASE Inc. | ||||||
12:40 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
12:55-14:25 | Lunch (free time) | |||||
14:25-16:45 | Session 16: Photonics IV (Glass and Polymer for Photonics) |
Session 17: Automotive Power Electronics | Session 19: Power Electronics Materials and devices of UWBG and WBG semiconductors | |||
Chairperson | Chairperson | Chairperson | ||||
Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Yutaka Uematsu (Hitachi, Ltd.) | Kentaro Kaneko (Ritsumeikan University) | ||||
Motohito Takezaki (Hakusan Inc.) | Atsushi Nakamura (Ultimate Technologies Inc.) | Hiroki Imabayashi (University of Fukui) | ||||
14:25 | (Invited) TBD | 16-01 | (Invited) EMC overview, Causes and Physics | 17-01 | (Invited) Recent progress and task of GaN materials and devices for power applications | 19-01 |
Hideho Yamamura | Yohei Otoki | |||||
Ultimate Technologies Inc. | SCIOCS Co. Ltd. | |||||
14:50 | Towards scalable aligned two photon lithography for photonic integration | 16-02 | A Review of BMW iX3 Power Module – Part 1: Inner Configuration, Die Attachment, Busbar Connection and Molding | 17-02 | Ag Sintering based Die Attach for Power Package and Power Module Applications | 19-02 |
Mareike Trappen, Matthias Blaicher, Tobias Hoose, Nicole Lindenmann, Stephan Dottermusch, Benjamin Richter, Andrea Bertoncini, Michael Thiel | Thiyu Warnakulasooriya, Jiyoon Choi, Sihoon Choi, Jun Imaoka, Masayoshi Yamamoto | Tamimoto Hideaki Tamimoto Hideaki, Kazuki Matsumura, Kazuyuki Nakagawa, Kenji Ikura, Chikara Obama | ||||
Nanoscribe GmbH & Co. KG | Nagoya University | Renesas Electronics Corporation | ||||
15:15 | Loss reduction of Y-branched single-mode polymer optical waveguide for MUX/DEMUX devices in mode division multiplexing links. | 16-03 | A Review of BMW iX3 Power Module – Part 2: Novel Heatsink Structure, Stacked-plate Fin Configuration | 17-03 | Simulation Study of Factor Effect on Transient Thermal Ramp Up Test Performance for Electronic Power Devices | 19-03 |
Seiya Sakai, Takaaki Ishigure | Jiyoon Choi, Thiyu Warnakulasooriya, Sihoon Choi, Jun Imaoka, Masayoshi Yamamoto | Nick Chenchao Zhong, Haibo Fan, Yuning Shi | ||||
Keio University | Nagoya University | Nexperia Group | ||||
15:40 | Polarization dependent characteristics of polymer optical waveguide | 16-04 | Session 18: Photonics V (Laser Technology for photonics) |
Effect of Sb dopant in r-GeO2 thin films for high-temperature growth | 19-04 | |
Chairperson | ||||||
Hideyki Nawata (Nissan Chemical Corporation) | ||||||
Junichi Inoue (Kyoto Institute of Technology) | ||||||
Takumi Wakabayashi, Takaaki Ishigure | Post-fab laser trimming: increasing yield and lowering power consumption of PICs | 18-01 | Toya Yagura1,2), Yuri Shimizu2), Toyosuke Ibi1), Isao Takahashi1), Kentaro Kaneko1,2) | |||
Ignazio Piacentini1), Louis-Rafael Robichaud2), Simon Duval2) | ||||||
Keio University | 1) IP Consulting 2) Femtum Inc. |
1) Patentix Inc. 2) Ritsumeikan Univ. |
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16:05 | Fabrication of a glass sub-mount with high heat dissipation | 16-05 | Heat Assisted Magnetic Recording - Ultra-dense laser and plasmonic component integration to increase storage density on magnetic media | 18-02 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |
Takuma Fujita, Asami Uchiyama, Shinya Okuda, Mizuki Shirao, Nobuo Ohata | Mark Gubbins, Beverley McConnell, Michael Kautzy, Anil Reddy, Richard Pitwon | |||||
Mitsubishi Electric Corpolation | Seagate Technology | |||||
16:30 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
16:45 | Close |