Photo Library of ICSJ2019 (Nov. 18-20, 2019)
Symposium attendees
Photo Album of Workshop in Nov. 18 AM
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| Plenary Speech I: "Photonic Integrated Circuits from Research to Manufacturing" Prof. Peter O'Brien (Tyndall National Institute) |
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| Plenary Speech II: "Integrated Photonics for 2020 and beyond" Prof. Ray T. Chen (The University of Texas at Austin) |
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Photo Album of Workshop in Nov. 18 PM
| Sorry for No Photos for Session 1 | ||
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| Session 2 | Session 2 | Session 2 |
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| Session 2 | Session 3 | Session 3 |
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| Session 3 | Session 4 | Session 4 |
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| Session 4 | Session 5 | Session 5 |
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| Session 5 | Session 5 | Session 6 |
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| Session 6 | Session 6 | Session 6 |
Photo Album of Welcome Reception
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Photo Album of Workshop in Nov. 19 AM
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| Plenary Speech III: "Novel crystalline and amorphous semiconductors" Prof. Hideo Hosono (Tokyo Institute of Technology) |
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| Plenary Speech IV: "2D-materials spread heat at nanoscales" Prof. Sebastian Volz (LIMMS/CNRS-IIS, The University of Tokyo) |
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| AI Special Speech I: "Photonic and memristive technologies on silicon for analog synaptic processing in neuromorphic computing" Dr. Bert Jan Offrein (IBM Research - Zurich) |
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Photo Album of Workshop in Nov. 19 PM
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| AI Special Speech II: "Ultra-Low Power Brain-Inspired Processors and Neuromorphic Processors with CMOS/MTJ Hybrid technology for Edge AI Systems" Prof. Tetsuo Endoh (Tohoku University) |
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| AI Special Speech III: "On-Device Learning and Its Applications: Toward Learning AI Chips" Dr. Hiroki Matsutani (Keio University) |
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| Session 7 | Session 7 | Session 7 |
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| Session 7 | Session 8 | Session 8 |
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| Session 8 | Session 8 | Session 9 |
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| Session 9 | Session 9 | Session 9 |
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| ECR Session | ECR Session | ECR Session |
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| ECR Session | ECR Session | ECR Session |
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| ECR Session | ECR Session | ECR Session |
Photo Album of Workshop in Nov. 20 AM
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| EPS Special Talk I: "Design Challenges for Advanced Electronic Packaging" Prof. Chris Bailey (University of Greenwich) |
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| EPS Special Talk II: "Electronic Packaging: The Next 20 Years" Dr. Beth Keser (Intel Corporation) |
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| Session 10 | Session 10 | Session 10 |
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| Session 11 | Session 11 | |
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| Session 12 | Session 12 | |
Photo Album of Workshop in Nov. 20 PM
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| Special Invited Talk: "Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging with Multi-layer RDL" Prof. S. W. Ricky Lee (Hong Kong University of Science & Technology) |
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| Session 13 | Session 13 | Session 14 |
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| Session 14 | Session 14 | Session 15 |
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| Session 15 | Session 15 | Session 15 |