Advance Program

November 9, 2015 (Monday)
Room A (Science Hall) Room B (AV Room) Room C (Innovation Room)
8:30 Registration
9:30-
11:45
Room A      (Science Hall) 
Chairpersons Takaaki Ishigure (Keio University) & Hideyuki Nasu (Furukawa Electric Co., Ltd.)
9:30 Opening Remarks & Welcome Talk: Shigeru Nakagawa (General Chair, IEEE CPMT Symposium Japan; IBM Research - Tokyo)
9:45 Plenary Speech 1: Glass for the Connected World ... Displays, Semiconductors and Communications
Waguih Ishak (Corning Incorporated)
10:40 Break
10:50 Plenary Speech 2: Multimode Polymer Waveguides for Very High Speed On-Board Optical Interconnects
Richard Penty (University of Cambridge)
11:45 Lunch (free time)
13:00-
15:00
Session 1: On-board Optics Session 2: Materials for Advanced Packaging Processes and Flexible Devices Session 3: Fan-Out Package
Chairpersons Chairpersons Chairpersons
Hidetoshi Numata (IBM Research-Tokyo) Tomonori Minegishi (Hitachi Chemical Co., Ltd.) Masahiro Inoue (Gunma University)
Jonas Weiss (IBM Research - Zurich) Samson Melamed (AIST) Taiji Sakai (Fujitsu Laboratories Ltd.)
13:00 (Invited) Compact Pluggable 300Gbit/s On-Board-Transceiver For High Density Optical Data Transmission I-28 Improvement in Dissolution Contrast of Positive-Tone Photo-Definable Poly (Benzoxazole) Materials 10 (Invited) The Potential of FOWLP. Can Cover 2.5D? I-07
Ulrich Keil Daisaku Matsukawa1, Tetsuya Enomoto1, Noritaka Matsuie2, and Masayuki Ohe2 Shuzo Akejima
(FCI Deutschland GmbH) (1. Hitachi Chemical Co.,Ltd, 2. Hitachi Chemical Dupont Microsystems,Ltd) (Toshiba Corporation)
13:25 A High-Density 300-Gbit/s Parallel Optical Interconnect Module with Efficient Optical Sub-Assembly 13 Application of Embedding Insulation Sheet (EBIS) for FO-WLP 23 (Invited) The Panel Level Assembly Technology Which is Changing Semiconductor Package I-18
Yasunobu Matsuoka1, Yong Lee1, Toshiaki Takai1, Norio Chujo1, Naoki Matsushima1, Masataka Sato2, Shinji Komatsuzaki2, Akira Ogura2, Kinya Yamazaki2, and Yoshinori Sunaga2 Masaya Toba Akio Katsumata
(1. Hitachi, Ltd., 2. Hitachi Metals, Ltd.) (Hitachi Chemical Co.,Ltd) (J-Devices Corporation)
13:50 A High-Density 300-Gbit/s Parallel Optical Interconnect Module with Efficient Thermal Dissipation Characteristics 45 New Non Conductive Film for High Productivity Process 43 Evaluation of Fan-Out Wafer Level Package Using 200 °C Curable Positive-Tone Photodefinable Polybenzoxazoles 9
Toshiaki Takai1, Norio Chujo1, Naoki Matsushima1, Yasunobu Matsuoka1, Yong Lee1, Hideo Arimoto1, Masataka Sato2, Shinji Komatsuzaki2, Akira Ogura2, and Kinya Yamazaki2 Masao Tomikawa, Kazuyuki Matsumura, Yohei Sakabe, and Yoichi Shinba Masato Nishimura1, Masaya Toba1, Noritaka Matsuie2, Takeharu Motobe2, and Masayuki Ohe2
(1. Hitachi, Ltd., 2. Hitachi Metals, Ltd.) (Toray Industries, Inc) (1. Hitachi Chemical Co., Ltd., 2. Hitachi Chemical DuPont MicroSystems, Ltd.)
14:15 (Invited) Progress towards Low Cost 1 Tb/s Optical Engines I-23 All in One PE Substrate: Highly Conducting Plastic Substrate with Surface Flatness and Gas Barrier Properties 24 Development of Bump Support Film (BSF) for expanding the size of WLCSP 44
Michael Tan Wataru Morita, Tsutomu Hara, Tsuyoshi Muto, and Takeshi Kondo Masanori Yamagishi1, Rey Alvarado2, Shinya Takyu1, Naoya Saiki1, and Akinori Sato1
(HP Labs) (Lintec Corporation Research Center) (1. Lintec Corporation, 2. Qualcomm Technologies, Inc.)
14:40 Interview with the Authors (Discussion after the session)
15:00 Coffee break
15:15-
17:40
Session 4: Polymer Waveguides Session 5: Thermal management
Chairpersons Chairpersons
Koichi Takemura (PETRA) Kishio Yokouchi (Fujitsu Interconnect Technologies Ltd.)
Henning Shröder (Fraunhofer IZM) Tomoyuki Hatakeyama (Toyama Prefectual University)
15:15 (Invited) Development of High Layer Count PCBs with Embedded Waveguides for High Speed Applications I-03 Basic Study on Cooling Performance of Pulsating Airflow around Components Mounted in High-Density Packaging Electronic Equipment (Effects of Shapes of Components on Cooling Performance) 42
Marika Immonen Takashi Fukue1, Koichi Hirose1, and Hidemi Shirakawa2
(TTM Technologies Inc.) (1. Iwate University, 2. National Institute of Technology, Toyama College)
15:40 Fabrication for Densely Aligned Multilayer GI Circular Core Polymer Optical Waveguides 19 Systemic Optimization of On-chip Thermoelectric Cooling 22
Kyuta Suzuki and Takaaki Ishigure Thanunathan Rangarajan, Tanay Karnik, Rahul Khanna, Kelly Lofgreen, Shammanna Datta, Davis Darvish, and Kaushik Vaidyanathan
(Keio University) (Intel Corporation)
16:05 Fabrication of Graded Index Profile in Self-Written Waveguide by UV Exposure Method 30 Highly Precise Technique of A Thermal Experiment and the Thermal Analysis in the Electronic Control Unit 27
Ryo Hirakawa and Kenichi Yamashita Takuya Shinoda1, Tomoyuki Hatakeyama2, and Masaru Ishizuka2
(Kyoto Institute of Technology) (1. Denso Corporation, 2. Toyama Prefectural University)
16:30 Interchannel Pitch Conversion (250 to 125 µm) in Multimode Polymer Optical Waveguide for High-Density Optical Wiring 20 Influence of Thermo-Mechanical Stress on the Microstructure of Sintered Silver Joints for Microelectronics 26
Hikaru Masuda and Takaaki Ishigure Thomas Geoffroy1, Jean-Christophe Riou1, Eric Bailly1, Yves Bienvenu2, and Gilles Tarrisse1
(Keio University) (1. Safran Electronics (Sagem), 2. Mines Paristech)
16:55 (Invited) Manufacturing and Performance of Silicone Polymer Waveguides for Optical Interconnects I-05 Sensitivity of the Thermal Profile of Bump-Bonded 3D Systems to Inter-die Bonding Layer Properties 50
Ken Weidner Samson Melamed, Katsuya Kikuchi, and Masahiro Aoyagi
(Dow Corning Corporation ) (National Institute of Advanced Industrial Science and Technology (AIST))
17:20 Interview with the Authors (Discussion after the session)
18:30 Welcome Reception
20:30 Close
November 10, 2015 (Tuesday)
Room A (Science Hall) Room B (AV Room) Room C (Innovation Room)
8:30 Registration
9:00-
10:00
Room A      (Science Hall) 
Chairpersons Shoji Uegaki (ASE Group) & Hiroshi Yamada (Toshiba Corporation)
9:00 CPMT Special Talk:
S.W. Ricky Lee (Hong Kong University of Science and Technology)
William Chen (ASE Group)
10:00-
12:00
Room A      (Science Hall) 
Chairperson Kiyokazu Yasuda (Osaka University)
10:00 Plenary 3: Future Society enabled by Trillion Sensors
Susumu Kaminaga (SPP Technologies Co., Ltd.)
10:55 Break
11:05 Plenary 4: Biomimetics: Innovative Engineering based on Biodiversity
Masatsugu Shimomura (Chitose Institute of Science and Technology)
12:00 Lunch (free time)
13:00-
15:00
Session 6: Optical Link Session 7: Bioelectronics I Session 8: 3D Package
Chairpersons Chairpersons Chairpersons
Akinori Hayakawa (Fujitsu Limited) Naoe Hosoda (National Institute for Materials Science) Kenji Takahashi (Toshiba Corporation)
Drew Guckenburger (Molex Incorporated) Kiyokazu Yasuda (Osaka University) Shinya Takyu (Lintec Corporation)
13:00 (Invited) High Speed Optical Interconnects with PAM4 Modulation for Short-Reach and Metro Applications I-11 (Invited) Highly Functional Ultrashort Pulse Fiber Laser Sources and Application for Optical Coherence Tomography I-08 (Invited)Brain Inspired Device in the era of Cognitive Computing I-25
Man Jiangwei Norihiko Nishizawa Yasumitsu Orii
(Huawei Technologies Co, Ltd.) (Nagoya University) (IBM Research - Tokyo)
13:25 Fully Engineered QSFP AOC Using Solderable 4-Channel Optical Transceiver Module 12 (Invited) Label Free Bioimaging Using Nonlinear Coherent Raman Microscopy I-20 Thermal Characterization and Modeling of BEOL for 3D Integration 29
Hideyuki Nasu, Yozo Ishikawa, Naoya Nishimura, Masao Shinoda, Atsushi Izawa, Kazuya Nagashima, Yoshinobu Nekado, and Tomofumi Kise Mamoru Hashimoto
Shunichi Kikuchi1, Makoto Suwada1, Hiroshi Onuki2, Yoshihisa Iwakiri2, and Naoaki Nakamura2
(Furukawa Electric Co., Ltd.) (Osaka University) (1. Fujitsu Limited, 2. Fujitsu Advanced Technologies Limited)
13:50 A Novel Lens System for High-Speed Light Peak Optical Link 39 (Invited) Raman Microscopy: Chemical and Analytical Imaging of Biomolecules I-13 Material Technology for 2.5D/3D TSV Package 14
H. S. Khoo, F. Chiang, S. Chen, C.-F. Shen, H. Shang, and J. Hou Katsumasa Fujita Kazuyuki Mitsukura1, Tatsuya Makino1, Keiichi Hatakeyama2, Kenneth June Rebibis3, Andy Miller3, and Eric Beyne3
(FOCI Fiber Optic Communications, Inc.) (Osaka University) (1. Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd., 2. Packaging Solution Center, Hitachi Chemical Co., Ltd., 3. 3D System Integration Program, Interuniversity Micro Electronics Center (IMEC))
14:15 CDR-Integrated Sn-Ag-Cu-Solder-Reflow-Capable Miniature 28-Gb/s x 4-Channel Module 21 Raman Spectroscopic Detection of Bio-Active Small Molecules Using Alkyne-Tag 32 Improving Self-Alignment Effect of Cu Balls by Organic and Inorganic Surface Coating 6
Kazuya Nagashima, Tomofumi Kise, Yozo Ishikawa, and Hideyuki Nasu Jun Ando1,2,3, Almar Palonpon1, Hiroyuki Yamakoshi3, Kosuke Dodo2,3, Satoshi Kawata1,
Mikiko Sodeoka
2,3, and Katsumasa Fujita1,2
Hiroyoshi Kawasaki1, Tomoaki NISHINO1, Takahiro Roppongi1, Daisuke SOMA1, Isamu SATO1, Yuji KAWAMATA1, Hirohiko HIRAO2, and Jun TASAKA2
(Furukawa Electric Co., Ltd.) (1. Department of Applied Physics, Osaka University, 2. AMED-CREST, Japan Agency for
Medical Research and Development, 3. Synthetic Organic Chemistry Laboratory, RIKEN)
(1. Senju Metal Industry Co., Ltd, 2. Shikoku Chemicals Corporation)
14:40 Interview with the Authors (Discussion after the session)
15:00 Coffee break
15:15-
17:40
Session 9: Waveguide Technologies Session 10: Bioelectronics II Session 11: Advanced Package Technologies
Chairpersons Chairpersons Chairpersons
Ken Weidner (Dow Corning Corporation) Shigenori Aoki (Fujitsu Laboratories, Ltd.) Masahiro Aoyagi (AIST)
Marika Immonen (TTM Technologies Inc.) Hiroshi Yamada (Toshiba) Akio Katsumata (J-Devices Corporation)
15:15 (Invited) Thin Glass Based Electro-Optical Circuit Board (EOCB): Waveguide Process, PCB Technology, and Coupling Interfaces I-01 (Invited) Functionality Emergence of Single Molecule Electronics I-15 (Invited) Electrical Interconnect Test Method of 3D ICs without Boundary Scan Flip Flops I-22
Henning Schröder Takuji Ogawa Masaki Hashizume
(Fraunhofer IZM) (Osaka University) (Tokushima University)
15:40 Low-Loss Light Coupling Design for a Multimode Polymer Optical Waveguide via 45-degree Mirrors 18 (Invited) In Vitro Bio-Circuit Sensing Based on Cell-Semiconductor Interaction I-09 (Invited) 3DIC/TSV Process Developments by Printing Technologies I-32
Yoshie Morimoto and Takaaki Ishigure Toshiya Sakata Hiroaki Ikeda
(Keio University) (The University of Tokyo) (Napra Co.,Ltd. )
16:05 Simple Channel Reconnection Using Polynorbornene Based GI Waveguide for Optical Interconnection 40 (Invited) Surface Modification of Medical Devices : Biocompatible Artificial Surface I-12 Package Structure Interaction Induced Molding Issues in MCM Packages 37
Akihiro Horimoto, Katsuma Kitazoe, and Ryota Kinoshita Kazuhiro Tanahashi Megan Chang and Bob Lee
(Sumitomo Bakelite Co., Ltd.) (Toray Industries Inc.) (Texas Instruments Taiwan Limited)
16:30 Organic-Inorganic Hybrid Material, "SUNCONNECT®" for Optical Interconnects 41 (Invited) New Biopolyimdies Possibly Applicable to Heat-Resistant and Transparent Insulator I-21 Parametric Optimization of Connector Press Fit Pin Deformation for High Volume Reliability 46
Hideyuki Nawata1, Takehiro Nagasawa1, Sayoko Tadokoro1, Kei YasuiI1, Daniel A. Sahade1, Sho Yoshida2, Yuki Saito2, Kazuki Yasuhara2, and Takaaki Ishigure2 Tatsuo Kaneko Mudasir Ahmad, Weidong Xie, and Qiang Wang
(1. Nissan Chemical Industries, LTD., 2. Keio University) (JAIST) (Cisco Systems Inc.)
16:55 Low loss Polymer Waveguide Components for Silicon Photonic Packaging 38 (Invited) Mobile Biosensors with Printable Electrodes I-17 Influential Parameters in the Development of Transient Liquid Phase Soldering (TLPS) as a New Interconnect System for High Power Lighting Applications 36
Hidetoshi Numata1, Yoichi Taira1, Tymon Barwicz2 Eiichi Tamiya Aarief Syed-Khaja and Joerg Franke
(1. IBM Research - Tokyo, 2. IBM T.J.Watson Research Center) (Osaka University) (Friedrich-Alexander-Universität Erlangen-Nürnberg)
17:20 Interview with the Authors (Discussion after the session)
17:40 Close
November 11, 2015 (Wednesday)
Room A (Science Hall) Room B (AV Room) Room C (Innovation Room)
8:30 Registration
9:00-
10:40
Special Session: 3D Printing
Room A      (Science Hall) 
Chairpersons Yutaka Uematsu (Hitachi ltd.) & Daisuke Iguchi (Fuji Xerox Co., Ltd.)
9:00 (Invited) Characteristics and Advantages of Additive Manufacturing (3D Printing) Technique Using Electron Beam Instead of Laser Beam I-19
Akihiko Chiba
(Tohoku University)
9:25 Advanced Substrate and Packaging Concepts for Compact System Integration with Additive Manufacturing Technologies for High Temperature Applications 35
Aarief Syed-Khaja, Daniel Schwarz, and Joerg Franke
(Friedrich-Alexander-Universität Erlangen-Nürnberg)
9:50 (Invited) From Rapid Prototyping to Production I-26
Nikolai Zaepernick
(EOS GmbH Electro Optical Systems)
10:15 (Invited) Laser sintering of high-temperature engineering plastics I-33
Toshiki Niino
(The University of Tokyo)
10:40 Break
10:50-
12:25
Session 12: Optical Connectivity Session 13: Bioelectronics III Session 14: Electrical Interconnect I
Chairpersons Chairpersons Chairpersons
Takaaki Ishigure (Keio University) Kiyokazu Yasuda (Osaka University) Hideki Oosaka (Hitach,Ltd.)
Man Jiangwei (Huawei Technologies Co, Ltd.) Yoshio Nogami (Toray Engineering Co.,Ltd.) Hideyuki Ohashi (Mitsubishi Electric corp.)
10:50 (Invited) High-Density Multi-Lane Connectivity for Optical Interconnect I-06 (Invited) Ecological Color Devices by Biomimetic Nanostructures I-14 Measurement of Transmission Line in GHz Region 28
Mitsuhiro Iwaya Akira Saito Daisuke Ogawa, Yutaka Akiyama, Chihiro Ueda, Kaoru Hashimoto, and Kanji Otsuka
(Furukawa Electric Co., Ltd.) (Osaka University) (Meisei University)
11:15 10 Tb/s Scale Optical Interconnection System Using High-Density Optical Wiring 7 (Invited) Biomimetic Multifunctional Wrinkle Suraface I-29 Electrical Performance Analysis of Fine Line on High Density Package Substrate 31
Norio Chujo, Naoki Matsushima, Akiko Mizushima, Toshiaki Takai, Kouichi Fukumiya, Itoe Akutsu Hiroshi Endo Ming-Fong Jhong, Hung-Hsiang Cheng, and Chen-Chao Wang
(Hitachi, Ltd.) (Toyama Prefectural University) (ASE Group)
11:40 Assembly Optimization for Low Power Optical MCM Link 34 Biomimetic Reversible Interconnection I-35 Improvement of Power Integrity with Die-Attached STO Thin Film Capacitors 48
Masao Tokunari, Hsiang-Han Hsu, Koji Masuda, and Shigeru Nakagawa Naoe Hosoda Masamitsu Yoshizawa2, Seisei Oyamada2, Atsunori Hattori1, Toru Nakura3, Masahiro Kano3, and Kunihiro Asada3
(IBM Research - Tokyo) (National Institute for Materials Science) (1. Noda Screen Co., Ltd., 2. Noda Techno Co., Ltd., 3. The University of Tokyo)
12:05 Interview with the Authors (Discussion after the session)
12:25 Lunch (free time)
13:25-
15:50
Session 15: Si-Photonics Session 16: Bioelectronics IV Session 17: Electrical Interconnect II
Chairpersons Chairpersons Chairpersons
Hideyuki Nasu (Furukawa Electric Co., Ltd.) Hiroshi Yamada (Toshiba) Keitaro Yamagishi (Mitsubishi Electric corp.)
Urich Keil (FCI Deutschland GmbH) Yoshio Nogami (Toray Engineering Co.,Ltd.) Hideki Oosaka (Hitach,Ltd.)
13:25 (Invited) Next Generation Transceivers for Datacom Applications I-02 Power, Signal Integrity for 25Gbps, 40dB Compensation Signal Conditioner for Backplane Architecture 17
Drew Guckenberger Kenji Kogo1, Norio Nakajima2, Fumio Yuki1, Naohiro Kohmu1, Takayasu Norimatsu1, Takashi Kawamoto1, and Takashi Muto2
(Molex Incorporated) (1. Research & Development Group, Hitachi Ltd., 2. Information & Telecommunication Systems Company, Hitachi Ltd.)
13:50 Experimental Study on Reflection Phase Rotation of Cavity-Resonator-Integrated Guided-Mode Resonance Filter 11 (Invited) Evolution of Automated Blood Pressure Monitor for Laypeople's Easy Use I-30 Impedance Matching Method for Jitter Reduction of 28Gbps Retimer 15
Junichi Inoue1, Hiroki Okuda1, Kenji Kintaka2, Kenzo Nishio1, and Shogo Ura1 Osamu Shirasaki Fumio Yuuki1, Kenji Kogo1, Takayasu Norimatsu1, Naohiro Kohmu1, Takashi Kawamoto1, Norio Nakajima2, and Takashi Mutou2
(1. Kyoto Institute of Technology, 2. National Institute of Advanced Industrial Science and Technology) (Omron Healthcare Co., Ltd.) (1. Research & Development Group, Hitachi Ltd., 2. Information & Telecommunication Systems Company, Hitachi Ltd.)
14:15 (Invited) Chip-Scale Packaging of the Hybrid-Integrated Si Photonic Transceiver "Optical I/O Core" I-04 (Invited) Wearable Sensing Devices for Unobtrusive Biomedical Monitoring I-16 Integrated Module Structure of Fan-Out Wafer Level Package for Terahertz Antenna 49
Koichi Takemura Kouji Fujii Daijiro Ishibashi, Shinya Sasaki, Yoshikatsu Ishizuki, Shinya Iijima, Yoshihiro Nakata, Yoichi Kawano, Toshihide Suzuki, Motoaki Tani, and Taisuke Iwai
(PETRA) (Nippon Telegraph and Telephone Corporation) (Fujitsu Laboratories, Ltd.)
14:40 (Invited) High-Dense Integrated 25-Gbps Silicon Photonic Transmitter and Receiver for On-Package Optical Interconnect I-10 (Invited) Wireless Body Area Network Using Magnetically-Coupled Wearable Coils I-31
Akinori Hayakawa Fukuro Koshiji
(PETRA) (Tokyo Polytechnic University)
15:05 (Invited) Optics and Silicon Photonics Packaging for Next Generation Datacenters  I-27
Jonas Weiss
(IBM Research - Zurich)
15:30 Interview with the Authors (Discussion after the session)
15:50 Close