Paper Award of the 8th Workshop
The workshop gives honors to the excellent papers with the
Best Paper Award and the Young Award. The candidates of the Young Award
are under 35 years old.
Best Paper Award:
�@Young Award:
Last updated: 2006/12/9
"Flip Chip with B-stageable Polymer Bump and Pre-applied Underfill for RFID Applications"
Bunya Watanabe, Dai Miyachika, Masanori Nakatoh
Emerson & Cuming, Ablestik Japan Co.
Masataka Mizukoshi
Fujitsu Laboratories
"Failure Analysis of Solder Joint of FCBGA"
Keisuke Sato, Koichi Hirosawa, Katsunobu Suzuki,
Chika Kakegawa
NEC Electronics