| November 4, 2014 | (Tuesday) | ||||||||
| Room A (Conference Hall I) | Room B (Conference Hall II) | Room C (Conference Hall III) | |||||||
| 9:00 | Registration | ||||||||
| 10:00- 12:15 |
Room A-B
Chairperson (Conference Hall I,II) Shigeru Nakagawa (IBM Research - Tokyo) |
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| 10:00 | Opening Remarks & Welcome Talk: Masahiro Aoyagi (General Chair, IEEE CPMT Symposium Japan; AIST) |
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| 10:15 | Plenary Speech 1: Progress in Photonic and Electronic Convergence Technologies for Silicon Optical Interposers Yasuhiko Arakawa (University of Tokyo) |
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| 11:15 | Plenary Speech 2: Digital/Analog Micro Fluidic Devices and Systems for Bio/Chemical Applications - Symmetory between Integrated Circuits and Micro Fluidic Systems - Shuichi Shoji (Waseda University) |
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| 12:15 | Lunch (free time) | ||||||||
| 13:15- 15:45 |
Session 1 (Special): Bioelectronics | ||||||||
| Chairperson | |||||||||
| Yoshio Nogami (Toray Engineering Co. Ltd.) | |||||||||
| Kiyokazu Yasuda (Osaka University) | |||||||||
| 13:15 | 01-1 (Invited (Special)) Visualization of tissue collagen with femtosecond laser: application to skin diagnosis and cell culture |
I-05 | |||||||
| Tsutomu Araki | |||||||||
| (Department of Mechanical Science and Bioengineering, Graduate School of Engineering Science, Osaka University) | |||||||||
| 14:05 | 01-2 (Invited) Micro Energy Harvester for Implantable Devices |
I-07 | |||||||
| Haixia (Alice) Zhang | |||||||||
| (Peking University) | |||||||||
| 14:30 | 01-3 Optical Micro Sensors Integration and Application |
47 | |||||||
| Nobutomo Morita and Renshi Sawada | |||||||||
| (Kyushu University) | |||||||||
| 14:55 | 01-4 Phase Stability Analysis of Swept Light Source with KTa1-xNbxO3 electro-optic deflector towards Doppler Optical Coherence Tomography |
5 | |||||||
| Shinya Hasegawa1, Mitsuru Shinagawa1, Seiji Toyoda2, Masahiro Ueno2, Yuzo Sasaki2, and Junya Kobayashi2 | |||||||||
| (Faculty of Science and Engineering, Hosei University1, NTT Device Innovation Center, NTT Corporation2) | |||||||||
| 15:20 | 01-5 (Invited) High-Density Wafer-level Heterogeneous Devices System Integration Pseudo-SoC Technology for Wearable Smart Intelligent Vital Signs Sensor Application |
I-13 | |||||||
| Hiroshi Yamada | |||||||||
| (Toshiba Corporation) | |||||||||
| 15:45 | Coffee break | ||||||||
| 16:15- 17:50 |
Session 2: Cooling/Thermal | Session 3: Photonics Interposer | Session 4: Materials/Bonding I | ||||||
| Chairperson | Chairperson | Chairperson | |||||||
| Kishio Yokouchi (FUJITSU INTERCONNECT TECHNOLOGIES LIMITED) | Shigenori Aoki (Fujitsu Laboratories Ltd.) | Osamu Suzuki (NAMICS CORPORATION) | |||||||
| Christophe Kopp (CEA LETI) | Takeyasu Saito (Osaka Prefecture University) | ||||||||
| 16:15 | 02-1 Evaluation of Thermal Interface Material with Electric Capacitance Measurement |
20 | 03-1 (Invited) Low power consumption Optical I/O core using hybrid integration of Si photonics circuits and electronics circuits for next generation optical interconnect |
I-12 | 04-1 Highly Moisture Resistant IGZO Films with a Barrier Layer for Flexible Transparent Conductive Substrates |
9 | |||
| Yasuhiro SAITO, Satoru Suzuki , and Takanori KOMURO | Kazuhiko Kurata | Koichi Nagatomo1, Tsutomu Hara1, Hiroshi Sakuma2, and Kiyoshi Ishii2 | |||||||
| (Graduate school of Engineering, Kanagawa Institute of Technology) | (Photonics Electronics Technology Research Association (PETRA)) | (Research Center, Lintec Corporation1, Utsunomiya University2) | |||||||
| 16:40 | 02-2 Lifetime Evaluation of Ultra-thin Polymer Pulsating Heat Pipe |
37 | 03-2 Dry-Film Polymer Waveguides for Silicon Photonics Chip Packaging |
22 | 04-2 Silica Nanowire Composites as New Coating Material for High-efficiency White Light Reflection |
10 | |||
| Susumu OGATA, Eiji SUKEGAWA, and Takahiro KIMURA | Hsiang-Han Hsu and Shigeru Nakagawa | Shuang Xi, Tielin Shi, Bo Gong, Xiaoping Li, and Zirong Tang | |||||||
| (Electronics Packaging Laboratory, Devices & Materials Laboratories, FUJITSU LABORATORIES LTD.) | (IBM Research - Tokyo) | (Wuhan National laboratory for Optoelectronics, and School of Mechanical Science and Engineering, Huazhong University of Science and Technology) | |||||||
| 17:05 | 03-3 Power Efficient Data Rate for Photonic Interposer |
29 | 04-3 Positive-Tone Photodefinable Polyimide For Low Temperature Cure |
14 | |||||
| Norio Chujo1, Yutaka Uematsu1, and Moritoshi Yasunaga2 | MATSUKAWA1, Tetsuya ENOMOTO1, Keishi ONO1, and Masayuki OHE2 | ||||||||
| (Yokohama Research Laboratory, Hitachi, Ltd.1, Graduate School of Systems and Information Engineering, Univ. of Tsukuba2) | (Hitachi Chemical Co.,Ltd.1, Hitachi Chemical DuPont MicroSystems, Ltd.2) | ||||||||
| 17:30 | Interview with the Authors | Interview with the Authors | Interview with the Authors | ||||||
| 18:00 | Welcome Reception | ||||||||
| 20:00 | Close | ||||||||
| November 5, 2014 | (Wednesday) | ||||||||
| Room A (Conference Hall I) | Room B (Conference Hall II) | Room C (Conference Hall III) | |||||||
| 9:30 | Registration | ||||||||
| 10:00- 12:00 |
Session 5: RF Electrical Interconnect | Session 6: Si Photonics | Session 10: Advanced Packaging I | ||||||
| Chairperson | Chairperson | Chairperson | |||||||
| Hideyuki Ohashi (Mitsubishi Electric Corp.) | Takaaki Ishigure (Keio University) | Shoji Uegaki (ASE Group) | |||||||
| Yutaka Uematsu (Hitachi Ltd.) | Jeroen Duis (TE Connectivity) | Kenji Takahashi (Toshiba Corporation) | |||||||
| 10:00 | 05-1 High Speed LCP Board (PALAP) for 28Gbps Transmission through 300mm |
16 | 06-1 (Invited) Opportunities and challenges for silicon photonics integration and packaging |
I-02 | 10-1 (Invited) Pluralism in Innovation - FC Cu Pillar and FOWLP |
I-01 | |||
| Ryohei Kataoka1, Koji Kondo1, Jun Akimichi1, Yutaka Akiyama2, Kaoru Hashimoto2, and Kanji Otsuka2 | Christophe Kopp | John Hunt, William Chen, Scott Chen, and Simon Wang | |||||||
| (DENSO Corporation1, Meisei University2) | (CEA LETI) | (ASE Group) | |||||||
| 10:25 | 05-2 Simulation of Differential Skew Considering Fiber Kink Effects |
2 | 06-2 (Invited) Over-1000-channel Hybrid Integrated Light Source with High Density Laser Diode Arrays on a Silicon Waveguide Platform for Ultra-high-bandwidth Optical Interconnections |
I-04 |
10-2 (Invited) Highly Reliable Fan out-WLP with Flex Material |
I-10 | |||
| Hideaki Nagaoka, Taiga Fukumori, Daisuke Mizutani, and Motoaki Tani | Takanori Shimizu1,2, Makoto
Okano1,3, Hiroyuki Takahashi1,2, Nobuaki Hatori1,2, Masashige Ishizaka1,2, Tsuyoshi Yamamoto1,2, Masahiko Mori1,3, Yutaka Urino1,2, Tsuyoshi Horikawa1,3, Takahiro Nakamura1,2, and Yasuhiko Arakawa1,4 |
Shuzo Akejima | |||||||
| (Fujitsu Laboratories Ltd.) | (Institute for Photonics-Electronics Convergence System Technology (PECST)1 , Photonics Electronics Technology Research Association (PETRA)2, National Institute of Advanced Industrial Science and Technology (AIST)3, Insititute of Industrial Science, The University of Tokyo4) | (Toshiba Corporation) | |||||||
| 10:50 | 05-3 A Study on Differential Mode to Common Mode Conversion due to Asymmetric Structure in Differential Transmission Line |
7 | 06-3 Direct Core Monitoring Technique for Passive Optical Alignment between Multichannel Silicon Waveguide and Single-mode Fiber Array |
39 | 10-3 Novel exposure system for FOWLP and MCM photolithography process |
28 | |||
| Ayumi MOTOHASHI, Fujiyuki NAKAMOTO, Yuichi SASAKI, Naoto OKA, and Hideyuki OH-HASHI | Kazunori Maruyama, Youoku Sachihiro, Youji Nishiyama, Yasuhiro Endo, Shigeaki Sekiguchi, and Shinichi Wakana | Kiyoshi Kitamura, Kazuhiro Nakai, Tatsuya Nagao, Yoshinao Norimitsu, and Hiroshi Matsui | |||||||
| (Mitsubishi Electric Corporation) | (Fujitsu Laboratories Ltd.) | (Dainippon Screen Mfg. Co., Ltd.) | |||||||
| 11:15 | 05-4 Miniaturized LTE Modem Sip Using Novel Multiple Compartments Shielding |
13 | 06-4 Precision assembly of polymer waveguide components for silicon photonic packaging |
41 | 10-4 Photosensitive insulation coating for a Copper RDL process |
40 | |||
| Simon Leou, Vincent Chen, JJ Chen, Thomas Wang, and Harrison Chang | Yoichi Taira, Tymon Barwicz, and Hidetoshi Numata | Hiroshi Matsutani1, Kazuyuki Mitsukura1, Fabrice Duval2, Mikael Detalle2, Andy Miller2, and Eric Beyne2 | |||||||
| (USI, ASE Group) | (IBM Research - Tokyo) | (Hitachi Chemical Co., Ltd.1, IMEC2) | |||||||
| 11:40 | Interview with the Authors | Interview with the Authors | Interview with the Authors | ||||||
| 12:00 | Lunch (free time) | ||||||||
| 13:00- 15:00 |
Session 8: Power Integrity/Signal Integrity I | Session 9: Photonics Link | Session 7: Materials/Bonding II | ||||||
| Chairperson | Chairperson | Chairperson | |||||||
| Hideki Osaka (Hitachi, Ltd.) | Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Masahiro Inoue (Gunma Univ.) | |||||||
| Daisuke Iguchi (Fuji Xerox Co., Ltd.) | Takatoshi Yagisawa (Fujitsu Laboratories Ltd.) | Taiji Sakai (FUJITSU Lab.)n) | |||||||
| 13:00 | 08-1 (Invited) Power Bus Noise Reduction Using Ferrite-covered Open Stub in Printed Circuit Board |
I-06 | 09-1 (Invited) The Cool Future of Optics "CoolBit" |
I-11 | 07-1 (Invited) Evolution of electrical conductivity of porous silver with short annealing time |
I-03 | |||
| Yoshitaka Toyota | Jeroen Duis | Kim S Siow1 and Abu Samah Zuruzi2 | |||||||
| (Okayama University) | (TE Connectivity) | (Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia1, Engineering Product Development Pillar, Singapore University of Technology and Design2) | |||||||
| 13:25 | 08-2 IO INTERFACE FOR OVER 25GBPS OPERATION WITH LOW POWER |
17 | 09-2 Loss Analysis for Optical MCM Based Optical Link |
11 | 07-2 Development of Combined Surface Activated Bonding (SAB) Method for Hydrophilic Wafer Bonding |
43 | |||
| Kanji Otsuka, Fumiaki Fujii, Yutaka Akiyama,and Kaoru Hashimoto | Hsiang-Han Hsu and Shigeru Nakagawa | Ran He1, Masahisa Fujino1, Akira Yamauchi2, and Tadatomo Suga1 | |||||||
| (Meisei University) | (IBM Research - Tokyo) | (Department of Precision Engineering, The University of Tokyo1, Bondtech Co., Ltd.2) | |||||||
| 13:50 | 08-3 Design and Analysis Method for Noise Supression of DC/DC Converter |
6 | 09-3 Assembly process for high bandwidth density organic optical MCM |
30 | 07-3 Electro-migration Behavior in Fine Pitch SnBi Eutectic Solder Bump Interconnections |
46 | |||
| Masahiro Terasaki, Souichi Tominaga, Yuta Ohashi, Yo
Masuyama, and Toshio Sudo |
Masao Tokunari and Shigeru Nakagawa | Kei Murayama, Mitsuhiro Aizawa, and Takashi Kurihara | |||||||
| (Shibaura Institute of Technology) | (IBM Research - Tokyo) | (Shinko Electric Industries Co., LTD.) | |||||||
| 14:15 | 08-4 On-board Snubber Circuit for Damping of Anti-resonance Peak in Total PDN |
18 | 09-4 3.3-Tb/s compact optical fiber package using pre-formed optical fiber |
35 | 07-4 Soldering Material for Fine PoP (Package on Package) |
21 | |||
| Toma Yamaguchi, Kanae Kurita, and Toshio Sudo | Rika Nomura1, Norio Chujo1, Akiko Mizushima1, Naoki Matsushima1, Kouichi Fukumiya2, Itoe Akutsu2, and Koji Hata2 | Yutaka Hashimoto, Nakano Shunsuke, Takagi Kazuyori, and Yuji Kawamata | |||||||
| (Shibaura Institute of Technology) | (Yokohama Research Laboratory, Hitachi, Ltd.1, Information &Telecommunication Systems Company, Hitachi, Ltd.2) | (SENJU METAL INDUSTRY CO.,LTD.) | |||||||
| 14:40 | Interview with the Authors | Interview with the Authors | Interview with the Authors | ||||||
| 15:00 | Coffee break | ||||||||
| 15:15- 17:15 |
Session 11: Power Integrity/Signal Integrity II | Session 12: Optical Transceiver | Session 13: Advanced Packaging II | ||||||
| Chairperson | Chairperson | Chairperson | |||||||
| Yoshitaka Toyota (Okayama University) | Kazuhiro Kurata (PETRA) | Hiroshi Yamada (Toshiba Corporation) | |||||||
| Toshio Sudo (Shibaura Institute of Technology) | Kenichi Yamashita (Kyoto Institute of Technology) | Shinya Takyu (Lintec Corporation) | |||||||
| 15:15 | 11-1 Analysis of Novel Technology for Power and Signal Integrity Using a Metal Particle Conductive Layer |
38 | 12-1 A Compact 25-Gbit/s X 4ch Optical Interconnect Module with Straddle-shaped Optical and Electrical Interface |
12 | 13-1 (Invited) Challenge of Packaging Technologies in the era of Cognitive Computing |
I-08 | |||
| Norifumi Sasaoka1, Masato Oono1, Chihiro Ueda2, and Kanji Otsuka2 | Yasunobu Matsuoka1, Yong Lee1, Hideo Arimoto1, Toshiaki Takai2, Norio Chujo2, Naoki Matsushima2, Masataka Sato3, Shinji Komatsuzaki3, Akira Ogura3, Kinya Yamazaki3, and Yoshinori Sunaga3 | Yasumitsu Orii | |||||||
| (Nippon Kodoshi Corporation1, Meisei University2) | (Central Research Laboratory, Hitachi, Ltd.1, Yokohama Research Laboratory, Hitachi, Ltd.2, Cable Materials Research Laboratory, Hitachi Metals, Ltd.3) | (IBM Research - Tokyo) | |||||||
| 15:40 | 11-2 A Feasibility Study of Novel Packaging Technology for Low Cost and High Performance Systems |
33 | 12-2 1060nm VCSEL-based 28-Gb/s' 4-channnel optical signal transmission beyond 500m MMF using high-density parallel-optical modules |
32 | 13-2 Design and demonstration of large 2.5D glass interposer for high bandwidth applications |
23 | |||
| Daisuke Iguchi and Hideyuki Umekawa | Kazuya Nagashima, Tomofumi Kise, Yozo Ishikawa, and Hideyuki Nasu | Taiji Sakai, Brett Sawyer, Hao Lu, Yutaka Takagi, Ryuta Furuya, Yuya Suzuki, Makoto Kobayashi, Vanessa Smet, Venky Sundaram, and Rao Tummala | |||||||
| (Fuji Xerox Co., Ltd.) | (FITEL Products Division, Furukawa Electric Co., Ltd.) | (Fujitsu Laboratories Ltd.1, Georgia Institute of Technology2, Zeon Corporation3, Namics Corporation4, NGK Spark plug Co., Ltd.5, Ushio Incorporated6) | |||||||
| 16:05 | 11-3 Improvement of Power Integrity with Thin Film Capacitors Embedded in Organic Interposer |
42 | 12-3 Novel Packaging Technologies for FPC-based Optical Transceiver for High-speed Optical Interconnect |
34 | 13-3 Influence of packaging on frequency drift in MEMS resonators |
15 | |||
| Masamitsu Yoshizawa1, Seisei Oyamada1, Atsunori Hattori2, Toru Nakura3, and Kunihiro Asada3 | Takatoshi Yagisawa, Mariko Sugawara, Takashi Shiraishi, and Kazuhiro Tanaka | Takuma Nishida, Yakichi Higo, Hiroshi Tanigawa, and Kenichiro Suzuki | |||||||
| ( Noda Techno Co. Ltd.1, Noda Screen Co. Ltd.2, VLSI Design and Education Center (VDEC), The University of Tokyo3) | (Fujitsu Laboratories Ltd.) | Ritsumeikan University | |||||||
| 16:30 | 13-4 Optimizing FCCSP Design in High Sensitivity Fingerprint Sensor |
45 | |||||||
| Chih-Yi Huang, Cheng-Yu Tsai, Tsai-Yun Hsieh, Chi-Tsung Chiu, Chun-Chieh Lin, Hung-Chun Kuo, Chih-Pin Hung, and Chen-Chao Wang | |||||||||
| (Electrical Laboratory, Advanced Semiconductor Engineering Inc) | |||||||||
| 16:55 | Interview with the Authors | Interview with the Authors | Interview with the Authors | ||||||
| 17:15 | Close | ||||||||
| November 6, 2014 | (Thursday) | ||||||||
| Room A (Conference Hall I) | Room B (Conference Hall II) | Room C (Conference Hall III) | |||||||
| 9:00 | Registration | ||||||||
| 9:30- 10:30 |
Room A-B
Chairperson (Conference Hall I,II) Masahiro Aoyagi (AIST) |
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| 9:30 | Plenary 3: Assembly and Packaging – A Differentiator For System Integration Bernd Römer (Infineon Technologies AG) |
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| 10:30- 12:00 |
Room A-B
Chairperson (Conference Hall I,II) Samson Melamed (AIST) |
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| 10:30 | Tutorial: Exploitation, Design, and Test of 2.5D- and 3D-Stacked ICs Paul Franzon (NCSU) |
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| 12:00 | Lunch (free time) | ||||||||
| 13:00- 15:00 |
Session 14: 3D Technology | Session 15: Technology for Optical Interconnect | Session 16: Materials/Bonding III | ||||||
| Chairperson | Chairperson | Chairperson | |||||||
| Yinghui Wang (The University of Tokyo) | Shigeru Nakagawa (IBM Research - Tokyo) | Jun Mizuno (Waseda Univ.) | |||||||
| Samson Melamed (AIST) | Yasunobu Matsuoka (Hitachi, Ltd.) | Kiyokazu Yasuda (Osaka University) | |||||||
| 13:00 | 14-1 (Invited) Low Cost & High Performance Through-Silicon-Via (TSV) for CMOS Image Sensor Application |
I-09 | 15-1 Fabrication for Low-Loss Polymer Optical Waveguides with 90deg Bending Using the Mosquito Method |
19 | 16-1 Stretchable and deformable Electronic Systems in thermoplastic Matrix Materials |
1 | |||
| Daniel X.Q. SHI | Asami Takahashi1 and Takaaki Ishigure2 | Thomas Löher, Manuel Seckel, and Andreas Ostmann | |||||||
| (Applied Science & Technology Research Institute (ASTRI)) | (Graduate
School of Science and Technology, Keio University1, Faculty of Science and Technology, Keio University2) |
(Technische Universität Berlin and Fraunhofer IZM) | |||||||
| 13:25 | 14-2 High Aspect Ratio TSV Etching Process for High-capacitor |
26 | 15-2 Organic-Inorganic Hybrid Materials for Wavelength Division Multiplexing Filter in Self-Written Waveguide Module |
36 | 16-2 Fabrication of Flexible Thermoelectric Thin Film Module using Micro Porous Structure |
8 | |||
| Takahide Murayama1,2, Toshiyuki Sakuishi1,2, Yasuhiro Morikawa1,2, and Koukou Suu1,2 | Okihiro Sugihara | Kunihisa Kato1, Tsuyoshi Muto1, Koji Miyazaki2, and Takeshi Kondo1 | |||||||
| (NMEMS Technology Research Organization, Tsukuba Research Center, ULVAC Inc.1, Institute of Semiconductor and Electronics Technologies2) | (Utsunomiya University Center for Optical Research & Education) | (Research Center, Lintec Corporation1, Department of Mechanical and Control Engineering, Kyushu Institute of Technology2) | |||||||
| 13:50 | 14-3 Fabrication and Electrical Characterization of Parylene-HT Liner Bottom-up Copper Filled Through Silicon Via (TSV) |
27 | 15-3 Design for PMT connector (Polymer waveguides connected with MT connector) |
3 | 16-3 High heat-resistant bio-based nanofiber substrate for flexible electronics |
24 | |||
| Bui Thanh Tung1, Xiaojin Cheng1,2, Naoya Watanabe1, Fumiki Kato1, Katsuya Kikuchi1, and Masahiro Aoyagi1 | Motohito Takezaki1 and Ryo Nagase2 | Ming-chun Hsieh, Hirotaka Koga, Masaya Nogi, and Katsuaki Suganuma | |||||||
| (National Institute of Advanced Industrial Science and Technology1, Loughborough University, United Kingdom2) | (HAKUSAN MFG. CO., LTD.1, Chiba Institute of Technology2) | (The Institute of Scientific and Industrial Research, Osaka University) | |||||||
| 14:15 | 14-4 Threshold Value Estimation of Electrical Interconnect Tests with Scan FFs |
31 | 15-4 High-speed optical beam scanning using KTN crystal |
4 | 16-4 In-situ Analysis of Electrical Conductivity Evolution in Epoxy-based Conductive Adhesives with Ag Loading during Curing Process |
44 | |||
| Kosuke Nanbara1, Shoichi Umezu1, Hiroyuki Yotsuyanagi1, Shyue-Kung Lu2, and Masaki Hashizume1 | T. Sakamoto, S. Toyoda, M. Ueno, and J. Kobayashi | Masahiro Inoue, Yoshiaki Sakaniwa, and Yasunori Tada | |||||||
| (The Univ. of Tokushima1, National Taiwan University of Science and Technology2) | (NTT Photonics Laboratories, NTT Corporation) | (Gunma University) | |||||||
| 14:40 | Interview with the Authors | Interview with the Authors | Interview with the Authors | ||||||
| 15:00 | Close | ||||||||