Facebook

Platinum Sponsor

Gold Sponsor

Silver Sponsor

Bronze Sponsor

Notice

December 2, 2021

December 1, 2021

  • The ICSJ2021 online platform website has been closed on November 30, 2021. The photo images took at the welcome reception have been uploaded to a share folder, the URL of which was announced to all of the registrants.
    If you have any questions, please send an e-mail to support@ieee-csj.org.



10th IEEE CPMT Symposium Japan (ICSJ2021)

November 10-12, 2021,

A Hybrid Event of On-site and Virtual Meetings

On-site Venue: Kyoto Univ. Clock Tower Centennial Hall, Kyoto, JAPAN

http://www.ieee-csj.org/

"Electronics Packaging for 5G and B5G"

 

"IEEE CPMT Symposium Japan (ICSJ)" is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. This conference was inaugurated in 1992 as "The VLSI Packaging Workshop in Japan (VPWJ)" to provide a platform for you to communicate and interact with global leaders in packaging technology. Later in 2010, this conference was renamed to "ICSJ" and ICSJ2021 is the 10th ICSJ meeting, or 19th conference since establishing VPWJ. This year, ICSJ2021 will be a hybrid event of on-site and virtual meetings where several presentation options are available for the authors to select and the details will be announced on the official website at a later date.

Electronics Packaging for 5G and B5G: The 5G commercial services have just began and provide higher transmission rate, lower latency, greater capacity of remote execution, and larger number of connected devices. The 5G advantages will dramatically advance the performance of IoT services, edge computing, augmented reality (AR) / virtual reality (VR), autonomous mobility, as well as artificial intelligence (AI), and future "beyond 5G (B5G)" mobile network will eventually provide 5G and B5G services to realize Internet of Everything (IoE) services. In 2021, our focus is on key electronics packaging technologies for the next-generation mobile networks and their applications for 5G and B5G services, and emphasizes on the following main topics: Photonics, Advanced Packaging, Process & Material, Power & Automotive Electronics, Bioelectronics, and Sensing Technologies. Additional topics of primary interest to the participants are listed below.

Other topics include (but not limited to):

+ 3D Packaging & Chip-on-Chip

+ Advanced Fine Pitch Packaging, Micro Bumping & CSP

+ Board-Level Integration & Integrated Substrate

+ Laminated Materials & Processing, Materials for Packaging

+ Reliability & Failure Mechanisms

+ Packaging for High-Speed Electrical Interconnect

+ Signal Integrity & Power Integrity

+ RF Components & Modules

+ Additive Manufacturing & 3D Printed Electronics

+ Brain-like Neuromorphic Chip Assembly

+ Resilient Packaging for Autonomous System

+ Low Power, Low Temperature & Ultra Low Noise System Packaging

This conference is a perfect opportunity for you to communicate, interact, exchange technical ideas, and discuss your latest novel research findings in 5G and B5G packaging technologies with experts from industry and academia. In addition to the regular sessions, there is an "Early Career Researchers' (ECR)" session for young researchers with less than 2-year experience in their professions and all students including Ph.D. to hold fruitful communications with the experts. The ECR sessions have been held as a poster session in the past conferences. Since ICSJ2021 is a hybrid virtual and on-site event, all ECR speakers of accepted abstracts must submit a professionally pre-recorded video of their poster presentation prior to the actual on-site face-to-face poster presentation.

Presentation options for the hybrid event:

ICSJ2021 will be a hybrid event for on-site meetings held in Kyoto University Clock Tower Centennial Hall, Kyoto, Japan and virtual meetings via online video conferencing, and the authors are requested to choose from the following options to give their presentation:

1) On-site oral presentation (remote discussion via interactive voice is available)
2) Virtual live and interactive oral presentation (remote discussion via interactive voice is available)
3) Virtual live and one-directional oral presentation (remote discussion via chat is available)
4) On-demand pre-recorded presentation (viewing only)

For plenary, special session, and invited speakers, the authors are requested to choose between option 1 and 2 to give their presentation. Whereas contributed speakers are requested to prioritize the options when submitting their proceeding paper and the mode of presentation will be assigned according to the capacity of the conference hall and speakers' preference.


Plenary, Special Session and Invited Speakers:

As of March 2021, the confirmed speakers are listed below:
Plenary Speakers
Martin Schell (Fraunhofer Heinrich Hertz Institute)
John H. Lau (Unimicron Technology Corporation)
Roberto Sabella (Ericsson)
Avi Baum (Hailo)
Special Speakers
Chris Bailey (University of Greenwich)
Sam Karikalan (Broadcom Inc.)
Robert Gee (Continental)
Alberto Valdes-Garcia (IBM Research)
Takehiro Nakamura (NTT DoCoMo, Inc.)
Session Invited Speakers:
Ignazio Piacentini (ficonTEC Service GmbH)
Chen-Chao Wang (ASE Group)
Agnes Tixier-Mita (The University of Tokyo)
Ki-Hun Jeong (KAIST)
Toru Ujihara (Nagoya University)
Ryo Sakamaki (AIST)
Takashi Noma (Murata Manufacturing Co., Ltd.)
Katsuya Kikuchi (AIST)
Toshio Ito (Shibaura Institute of Technology)
Dongshun Bai (Brewer Science, Inc.)
Samuel Graham (Georgia Institute of Technology (Currently University of Maryland))
Geert Van Steenberge (Ghent University)
Harald Haas (University of Strathclyde)
Mario Baum (Fraunhofer ENAS)

The above list of speakers will be updated and announced on the ICSJ official website.


General Chair:

Hideyuki Nasu (Furukawa Electric Co., Ltd)

Vice Chair:

Kazuyuki Nakagawa (Renesas Electronics Corporation)

Chris Bailey (University of Greenwich)

Program Chair:

Taiji Sakai (Fujitsu Interconnect Technologies Ltd.)

Beomjoon Kim (The University of Tokyo)

Eiji Higurashi (AIST)


Financial Sponsor:

IEEE Electronics Packaging Society (EPS)

Cooperation:

IEEE EPS Japan Chapter

IEEE Kansai Section

IEEE Photonics Society UK & Ireland Chapter

Corporate Sponsor:

Platinum Sponsor: Furukawa Electric Co., Ltd., Huawei Technologies Co., Ltd., LINTEC Corporation, NAGASE & CO., LTD.

Gold Sponsor: Musashi Engineering Inc., S.E.R. Corporation, Zymet Inc., KYOCERA Corporation, BNS Medicals, KYOTO SHISAKU NET

Silver Sponsor: Tecnisco Ltd., Namics Corporation, Shinko Electric Industries Co., Ltd., FUJITSU INTERCONNECT TECHNOLOGIES LIMITED, Yuetsu Seiki Co., Ltd.

Bronze Sponsor: Samco Inc., SENKO Advance Co., Ltd.


On-site Conference Venue:

Kyoto University Clock Tower Centennial Hall
Yoshidahonmachi, Sakyo-ku, Kyoto, 606-8501, Japan

 

Official Sponsors

In cooperation with:

Grant funding from:


Keio Engineering Foundation


The Murata Science Foundation

Supported by:


Video Factory Kyoto

Back to top page