"Packaging Everywhere"

 

“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.

Packaging is everywhere! The conference started in 1992 as “The VLSI Packaging Workshop in Japan” and was renamed to “ICSJ” in 2010. Topics include a variety of packaging technologies, ranging from VLSI and 3D packaging, optoelectronics, bio and healthcare. In 2015 the conference will emphasize two main topics: Optoelectronics and Bio-healthcare. Optoelectronics will include optical interconnect, Si Photonics, telecom/datacom, and LEDs. Bio-healthcare will cover bioelectronics, sensing, biomimetics, and wearable devices. Advanced topics of primary interest to the participants include Advanced Packaging, Thermal and Reliability, and RF and Electrical Interconnect. This year, ICSJ will have a special session on 3D Printing."

"Please register online."

 

Plenary and Invited Speakers: (subject to change)

Plenary Speakers
Waguih Ishak (Corning Incorporated)
Richard Penty (University of Cambridge)
Susumu Kaminaga (SPP Technologies Co., Ltd.)
Masatsugu Shimomura (Chitose Institute of Science and Technology)
Invited Speakers
Optoelectronics:
Henning Schröder (Fraunhofer IZM)
Drew Guckenberger (Molex Incorporated)
Marika Immonen (TTM Technologies Inc.)
Koichi Takemura (PETRA)
Ken Weidner (Dow Corning Corporation)
Mitsuhiro Iwaya (Furukawa Electric Co., Ltd.)
Akinori Hayakawa (PETRA)
Man Jiangwei (Huawei Technologies Co, Ltd.)
Michael Tan (HP Labs)
Jonas Weiss (IBM Research - Zurich)
Ulrich Keil (FCI Deutschland GmbH)
Bio-Healthcare:
Norihiko Nishizawa (Nagoya University)
Toshiya Sakata (The University of Tokyo)
Kazuhiro Tanahashi (Toray Industries Inc.)
Katsumasa Fujita (Osaka University)
Akira Saito (Osaka University)
Takuji Ogawa (Osaka University)
Kouji Fujii (NTT)
Eiichi Tamiya (Osaka University)
Mamoru Hashimoto (Osaka University)
Tatsuo Kaneko (JAIST)
Hiroshi Endo (Toyama Prefectural University)
Osamu Shirasaki (Omron Healthcare)
Fukuro Koshiji (Tokyo Polytechnic University)
Advanced Packaging:
Shuzo Akejima (Toshiba Corporation)
Akio Katsumata (J-devices)
Masaki Hashizume (Tokushima University)
Yasumitsu Orii (IBM Research - Tokyo)
Hiroaki Ikeda (Napra)
Special Session: 3D Printing
Akihiko Chiba (Tohoku University)
Yasuaki Hashizume (NTT DATA ENGINEERING SYSTEMS Corporation)
Toshiki Niino (University of Tokyo)
CPMT Special
S.W. Ricky Lee (Hong Kong University of Science and Technology)
Bill Chen (ASE Global)

 

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