"Packaging Everywhere"


“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.

Packaging is everywhere! The conference started in 1992 as “The VLSI Packaging Workshop in Japan” and was renamed to “ICSJ” in 2010. Topics include a variety of packaging technologies, ranging from VLSI and 3D packaging, optoelectronics, bio and healthcare. In 2015 the conference will emphasize two main topics: Optoelectronics and Bio-healthcare. Optoelectronics will include optical interconnect, Si Photonics, telecom/datacom, and LEDs. Bio-healthcare will cover bioelectronics, sensing, biomimetics, and wearable devices. Additional topics of primary interest to the participants are listed below.

Other topics include (but not limited to):

+ 3D Packaging & Chip on Chip

+ Advanced Fine Pitch Packaging

+ Micro Bumping Technology, Wafer Level CSP

+ Board-Level Integration

+ Integrated Substrate

+ Laminated Materials & Processing

+ Thermal Management

+ Reliability & Failure Mechanisms

+ Packaging for High-Speed Electrical Interconnect

+ Signal Integrity / Power Integrity

+ RF Components & Modules

+ Materials for Packaging

Bring your latest research results, share them with experts from industry and academia, and discuss your work with them. Anybody in the field of the packaging technologies is very welcome to present their latest accomplishments and participate in the discussion. The conference will provide a perfect opportunity to communicate, interact, and exchange technical ideas.

You can download the information about Call for papers of ICSJ2015 (PDF file).

Authors are invited to submit a PDF file (free format and one page at A4 size) which includes 500-word abstract through the Abstract Submission Website.

Abstract Submission

ICSJ2015 is still accepting your Abstract Submission.


Plenary and Invited Speakers: (subject to change)

Plenary Speakers
Waguih Ishak (Corning Incorporated)
Richard Penty (University of Cambridge)
Susumu Kaminaga (SPP Technologies Co., Ltd.)
Masatsugu Shimomura (Chitose Institute of Science and Technology)
Invited Speakers
Henning Schröder (Fraunhofer IZM)
Drew Guckenberger (Molex Incorporated)
Marika Immonen (TTM Technologies Inc.)
Koichi Takemura (PETRA)
Ken Weidner (Dow Corning Corporation)
Mitsuhiro Iwaya (Furukawa Electric Co., Ltd.)
Akinori Hayakawa (Fujitsu Laboratories, Ltd.)
Man Jiangwei (Huawei Technologies Co, Ltd.)
Michael Tan (HP Labs)
Jonas Weiss (IBM Research - Zurich)
Ulrich Keil (FCI Deutschland GmbH)
Norihiko Nishizawa (Nagoya University)
Toshiya Sakata (The University of Tokyo)
Kazuhiro Tanahashi (Toray Industries Inc.)
Katsumasa Fujita (Osaka University)
Akira Saito (Osaka University)
Takuji Ogawa (Osaka University)
Kouji Fujii (NTT)
Eiichi Tamiya (Osaka University)
Mamoru Hashimoto (Osaka University)
Tatsuo Kaneko (JAIST)
Advanced Packaging:
Shuzo Akejima (Toshiba Corporation)
Akio Katsumata (J-devices)
Masaki Hashizume (Tokushima University)
S.W. Ricky Lee (Hong Kong University of Science and Technology)
Yasumitsu Orii (IBM Research - Tokyo)
Special Session: 3D Printing
Akihiko Chiba (Tohoku University)
Hashizume Yasuaki (NTT DATA ENGINEERING SYSTEMS Corporation)



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